Abstract: A copper-aluminum-indium alloy approaches gold in spectral appearance, tarnish resistance and mechanical durability, by virtue of a specific formulation and microstructure. The formulation consists of the following essential ingredients by total weight, in a copper matrix: from 7 to 12% of aluminum, from 5 to 11% of indium, and no more than 3% of a essentially non-ferromagnetic remainder. The required microstructure is in the form an essentially ternary alloy having a quenched single phase, an average grain size of no more than 100 .mu.m in diameter. Preferably, the above specified 3% remainder includes: a modifier selected from the class consisting of boron, silicon, lithium, magnesium, zinc and phosphorous; a strengthener selected from the class consisting of silver, gold, palladium, platinum, iridium, ruthenium and rhodium; and a system stabilizer, preferably selected from the class consisting of yttrium, cerium, lanthanum, hafnium, zirconium, chromium, titanium, nickel, iron and manganese.