Patents by Inventor Grant D. Daniels

Grant D. Daniels has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230372962
    Abstract: System and process that continuously circulates hotmelt adhesive at a circulating pressure rate to apply hotmelt adhesive to a moving substrate on a substrate delivery conveyor. The system includes an adhesive delivery line connected to an elongated manifold, the manifold including: (i) a main internal fluid pathway in fluid communication with the adhesive delivery line and an adhesive return line, and (ii) an elongated heater providing a substantially constant internal temperature to the elongated manifold. An adhesive pump transporting hotmelt adhesive from the adhesive reservoir to the adhesive delivery line under pressure, the adhesive reservoir including a filter that filters hotmelt adhesive. A plurality of hotmelt spray heads in fluid communication with the main internal fluid pathway to dispense hotmelt adhesive onto the moving substrate. The adhesive return line in fluid communication with the adhesive pump and/or the adhesive reservoir to transport hotmelt adhesive from the elongated manifold.
    Type: Application
    Filed: July 31, 2023
    Publication date: November 23, 2023
    Applicant: C3 Corporation
    Inventors: Joseph F. Van De Hey, Alex M. Zirbel, Alex N. Kuffel, Jeffery J. VanHandel, Grant D. Daniels, Scott S. Ebben
  • Patent number: 11752517
    Abstract: System and process that continuously circulates hotmelt adhesive at a circulating pressure rate to apply hotmelt adhesive to a moving substrate on a substrate delivery conveyor. The system includes an adhesive delivery line connected to an elongated manifold, the manifold including: (i) a main internal fluid pathway in fluid communication with the adhesive delivery line and an adhesive return line, and (ii) an elongated heater providing a substantially constant internal temperature to the elongated manifold. An adhesive pump transporting hotmelt adhesive from the adhesive reservoir to the adhesive delivery line under pressure, the adhesive reservoir including a filter that filters hotmelt adhesive. A plurality of hotmelt spray heads in fluid communication with the main internal fluid pathway to dispense hotmelt adhesive onto the moving substrate. The adhesive return line in fluid communication with the adhesive pump and/or the adhesive reservoir to transport hotmelt adhesive from the elongated manifold.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: September 12, 2023
    Assignee: C3 Corporation
    Inventors: Joseph F. Van De Hey, Alex M. Zirbel, Alex N. Kuffel, Jeffery J. VanHandel, Grant D. Daniels, Scott S. Ebben
  • Publication number: 20220362798
    Abstract: System and process that continuously circulates hotmelt adhesive at a circulating pressure rate to apply hotmelt adhesive to a moving substrate on a substrate delivery conveyor. The system includes an adhesive delivery line connected to an elongated manifold, the manifold including: (i) a main internal fluid pathway in fluid communication with the adhesive delivery line and an adhesive return line, and (ii) an elongated heater providing a substantially constant internal temperature to the elongated manifold. An adhesive pump transporting hotmelt adhesive from the adhesive reservoir to the adhesive delivery line under pressure, the adhesive reservoir including a filter that filters hotmelt adhesive. A plurality of hotmelt spray heads in fluid communication with the main internal fluid pathway to dispense hotmelt adhesive onto the moving substrate. The adhesive return line in fluid communication with the adhesive pump and/or the adhesive reservoir to transport hotmelt adhesive from the elongated manifold.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 17, 2022
    Applicant: C3 Corporation
    Inventors: Joseph F. Van De Hey, Alex M. Zirbel, Alex N. Kuffel, Jeffery J. VanHandel, Grant D. Daniels, Scott S. Ebben