Patents by Inventor Grant H. Ancarrow

Grant H. Ancarrow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6554687
    Abstract: A semiconductor wafer manufactured with a precise crystallographic-orientation alignment mark and a method of manufacturing. The method of manufacturing may include forcibly directing a carrier medium containing an abrasive material through a stencil to effect abrasive impact removal of a semiconductor surface in a defined machining area. The abrasive impact removal may be part of an automated machining process.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: April 29, 2003
    Assignee: Virginia Semiconductor, Inc.
    Inventors: Stephen H. Jones, Thomas G. Digges, Jr., Christopher Mark Mann, Grant H. Ancarrow