Patents by Inventor Grant H. Wurdell

Grant H. Wurdell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8271100
    Abstract: A medical electrical lead includes a lead body, an inner assembly extending throught the lead body, an outer insulative layer covering the inner assembly, and an electrode mounted outside the exterior surface of the outer insulative layer. The inner assembly includes an elongate inner structure forming a lumen, an elongate conductor extending along an outer surface of the inner structure, and a conductive fitting coupled to the elongate conductor.
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: September 18, 2012
    Assignee: Medtronic, Inc.
    Inventors: Gregory A. Boser, Ryan J. Collins, Mark T. Marshall, Grant H. Wurdell
  • Publication number: 20100174350
    Abstract: A method for making an elongate medical device includes coupling a conductive fitting to an elongate conductor and providing an opening through an insulative layer in proximity to the fitting in order to expose the fitting.
    Type: Application
    Filed: March 18, 2010
    Publication date: July 8, 2010
    Applicant: Medtronic, Inc.
    Inventors: Gregory A. Boser, Ryan J. Collins, Mark T. Marshall, Grant H. Wurdell
  • Patent number: 7715926
    Abstract: A medical electrical lead includes a lead body, an inner assembly extending through the lead body, an outer insulative layer covering the inner assembly, and an electrode mounted outside the exterior surface of the outer insulative layer. The inner assembly includes an elongate inner structure forming a lumen, an elongate conductor extending along an outer surface of the inner structure, and a conductive fitting coupled to the elongate conductor.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: May 11, 2010
    Assignee: Medtronic, Inc.
    Inventors: Gregory A. Boser, Ryan J. Collins, Mark T. Marshall, Grant H. Wurdell
  • Publication number: 20040069401
    Abstract: A wasteless lamination mechanism that laminates a topcoat or lamina onto a substrate, without requiring cutting of the lamina down to the size of the substrate. The substrate is preferably a card, such as an identification card, a credit card, or other CR80 size card. A lamina to be laminated onto a substrate is separated from a web containing a plurality of lamina after lamination of the leading portion of the web to the substrate begins. As a result, the rollers of the lamination station can be used to transport the lamina, thereby avoiding the need for a separate transport mechanism for transporting the lamina to the lamination station.
    Type: Application
    Filed: June 23, 2003
    Publication date: April 15, 2004
    Inventors: Grant H. Wurdell, Steven J. Fitzsimmons