Patents by Inventor Grant R. Adams, Jr.

Grant R. Adams, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6672879
    Abstract: A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: January 6, 2004
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
  • Patent number: 6607120
    Abstract: A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board.
    Type: Grant
    Filed: December 23, 1999
    Date of Patent: August 19, 2003
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
  • Patent number: 6256879
    Abstract: A connector utilized to electrically connect together conductive pads disposed on different substrates includes a flexible substrate having a plurality of conductive through-holes therein. A conductive line formed in the flexible substrate extends between at least two of the conductive through-holes. A plurality of contacts is mounted in the conductive through-holes of the flexible substrate. Each contact includes a post connected to a base of a crown-shaped head having a plurality of projections around the periphery of the base that extend away from the base in the direction opposite the post. The post of each contact is soldered into one of the plurality of conductive through-holes. A compression mat positioned on a side of the flexible substrate opposite the crownshaped heads includes a plurality of resilient cylinders that extend away from a resilient base. Each resilient cylinder has a distal end alignable in registration with a distal end of the post of one of the plurality of contacts.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: July 10, 2001
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
  • Patent number: 6036502
    Abstract: A flexible circuit compression connector system utilized to electrically connect together conductive pads disposed on a rigid printed circuit board, the connector system comprising a flexible insulating substrate having conductive material at a plurality of preselected positions and a conductive line extending between at least two of the preselected positions, a plurality of contacts, each contract secured to the flexible substrate at each of the preselected positions having conductive material, a compression assembly that includes a resilient compression mat and means for aligning the flexible substrate of the compression assembly and the rigid substrate together so that the resilient compression mat urges the contacts secured to the flexible substrate against the conductive pads on the printed circuit board.
    Type: Grant
    Filed: January 28, 1999
    Date of Patent: March 14, 2000
    Assignee: Intercon Systems, Inc.
    Inventors: Douglas A. Neidich, Grant R. Adams, Jr.
  • Patent number: 5899757
    Abstract: A connector utilized to electrically connect together conductive pads disposed on different substrates includes a flexible substrate having a plurality of conductive through-holes therein. A conductive line formed in the flexible substrate extends between at least two of the conductive through-holes. A plurality of contacts are mounted in the conductive through-holes of the flexible substrate. Each contact includes a post connected to a base of a crown-shaped head having a plurality of projections around the periphery of the base that extend away from the base in the direction opposite the post. The post of each contact is soldered into one of the plurality of conductive through-holes. A compression mat positioned on a side of the flexible substrate opposite the crown-shaped heads includes a plurality of resilient cylinders that extend away from a resilient base. Each resilient cylinder has a distal end alignable in registration with a distal end of the post of one of the plurality of contacts.
    Type: Grant
    Filed: November 3, 1997
    Date of Patent: May 4, 1999
    Assignee: InterCon Systems, Inc.
    Inventors: Douglas A. Neidich, Grant R. Adams, Jr.