Patents by Inventor Grant Richard Lee

Grant Richard Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8530746
    Abstract: Multilayer polyimide-fluoropolymer insulation structures exhibiting excellent heat seal strength and superior internal adhesion strength comprise a base layer of polyimide having first and second major surfaces and a first fluoropolymer layer. The first fluoropolymer layer may be on the first major surface of the polyimide layer. Alternatively, it may be separated from the first major surface of the polyimide layer by an intervening layer. The first fluoropolymer layer comprises from about 70 to about 98% by weight of fluoroethylene propylene polymer (‘FEP’) and from about 30 to about 2% by weight of polytetrafluoroethylene polymer (‘PTFE’) or poly(tetrafluoroethylene-co-perfluoro[alkyl vinyl ether]) (‘PFA’) based on the total weight of the first fluoropolymer layer. Structures having fluoropolymer layers on both surfaces of the polyimide layer are also provided. Protected wire or cable using the composite, and methods are also described.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: September 10, 2013
    Assignee: Kaneka North America LLC
    Inventors: Haibin Zheng, Gregory Douglas Clements, Grant Richard Lee
  • Publication number: 20100282488
    Abstract: Multilayer polyimide-fluoropolymer insulation structures exhibiting excellent heat seal strength and superior internal adhesion strength comprise a base layer of polyimide having first and second major surfaces and a first fluoropolymer layer. The first fluoropolymer layer may be on the first major surface of the polyimide layer. Alternatively, it may be separated from the first major surface of the polyimide layer by an intervening layer. The first fluoropolymer layer comprises from about 70 to about 98% by weight of fluoroethylene propylene polymer (‘FEP’) and from about 30 to about 2% by weight of polytetrafluoroethylene polymer (‘PTFE’) or poly(tetrafluoroethylene-co-perfluoro[alkyl vinyl ether]) (‘PFA’) based on the total weight of the first fluoropolymer layer. Structures having fluoropolymer layers on both surfaces of the polyimide layer are also provided. Protected wire or cable using the composite, and methods are also described.
    Type: Application
    Filed: December 22, 2008
    Publication date: November 11, 2010
    Inventors: Haibin Zheng, Gregory Douglas Clements, Grant Richard Lee
  • Publication number: 20100209681
    Abstract: A dielectric composite is provided that is useful for wrapping wire or cable or for supporting electronic circuitry. The composite comprises a polyimide layer having first and second major surfaces; a first fluoropolymer layer on the first major surface on the polyimide layer, said first fluoropolymer layer comprising at least about 55% PFA; and a second fluoropolymer layer on the second major surface on the polyimide layer, said second fluoropolymer layer comprising at least about 55% PFA. Protected wire or cable using the composite, and methods are also described.
    Type: Application
    Filed: September 5, 2008
    Publication date: August 19, 2010
    Inventors: Grant Richard Lee, Gregory Douglas Clements