Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.

Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.

Abstract: The disclosed device may include a radio frequency (RF) component and a thermal management component establishing a thermal path with the RF component. The device may also include an RF filter electrically that is coupled to the RF component and arranged away from the thermal path. The device may further include a chassis for housing the RF component. The thermal management component and the RF filter may be positioned near an exterior of the chassis. Various other devices, apparatuses, and systems are also disclosed.

Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.

Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a. BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch PT. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.

Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a. BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch PT. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, K wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.

Abstract: In an example of this disclosure, a method may include receiving, by a bit error location analyzer, a split information signal at a second data rate derived from an information signal at a first data rate. In this example, the second data rate is less than the first data rate, and the bit error location analyzer may be incapable of performing error analysis at the first data rate The method may include performing error analysis, by the bit error location analyzer, on information represented by the split information signal. In some examples, performing error analysis may include comparing the information represented by the split information signal to an information seed to determine a plurality of bit error locations in the information represented by the split information signal relative to the information seed.