Abstract: Detection apparatus can include a positioning device with a wall including a substantially conical inner surface and a detection device configured to send and receive signals and move along the conical inner surface. Detection apparatus are also provided that comprise a positioning device and an end portion with an image port, a light device, and a detection device configured to send and receive signals. Ultrasonic transducer devices are also provided with a transducer material layer, a contact plating layer including a convex portion with an array of transducer elements, an acoustic matching layer, and a top plating layer.

Abstract: CMUT elements are formed on a substrate. Electrical conductors are formed to interconnect between different portions of the substrate. The substrate is then separated into pieces while maintaining the electrical connections across the separation. Since the conductors are flexible, the separated substrate slabs may be positioned on a curved surface while maintaining the electrical interconnection between the slabs. Large curvatures may be provided, such as associated with forming a multidimensional transducer array for use in a catheter. The electrical interconnections between the different slabs and elements may allow for a walking aperture arrangement for three dimensional imaging.

Abstract: Electronic cross-talk is reduced in an ultrasound transducer. Ground traces are interleaved with signal traces on a flexible film. By providing ground traces between the signal traces, the electrical cross-talk between signal traces is reduced.

Abstract: A multi-dimensional transducer array has pitch along one dimension less than the pitch along a second dimension. The multi-dimensional transducer array with the same or different pitch is manufactured from a plurality of modules. Each of the modules are separately diced and then aligned and combined. Elements of a transducer array are used for isolating a transmit channel from a receive channel. Separate signal lines or traces are provided individually for each element on opposite sides of each element. A transmit channel may connect to one electrode on an element, and the receive channel may connect to an opposite electrode on the element. A multi-dimensional array is provided for time division multiplex processing. A probe houses the multi-dimensional array and a multiplexer.

Abstract: Electrical connection is provided in a transducer stack through a backing block. A flexible circuit is sandwiched between pieces of acoustic attenuating material. For example, 2 to 200 or more flexible circuits are stacked in alternating layers with pieces of acoustically attenuating material. The alternating layers are then connected together to form a backing block with Z-axis electrical connection. The top surface of the connected backing block includes a plurality of exposed electrical traces from the flex circuit. Since flex circuits are used, the electrical traces are precisely aligned along one dimension. Since pre-formed acoustic attenuating material pieces are used, precise alignment is provided along a second or orthogonal dimension. The substrate holding the electrical traces in the flexible circuits provides more stability and allows for easier connection to circuit boards as compared to individual strips of metal.

Abstract: Electrical interconnects are provided for CMUTs. For example, electrodes within the silicon substrate, such as the electrodes at the bottom of the void below membranes, are interconnected together within the substrate. The interconnected electrode may then be used as the grounding electrode. By providing interconnection within the substrate and below the membranes, space for vias and the associated connection between the electrodes on an exposed surface of the substrate is minimized. As another example, an electrical conductor is formed on the side of the silicon substrate rather than the top of the substrate. Conductors on the side may allow routing signals from a top surface to a bottom surface without large wire bonding pads. Alternatively, conductors on the edge provide additional space for wire bonding pads. As yet another example, polymer material used as a matching or protection layer is formed on the top surface of the CMUT with electrical traces routed within the polymer.

Abstract: Methods, systems, and probes are provided for medical ultrasound imaging. By using larger segments for transmit than receive or by using a sparse sampling of elements on transmit than used for receive, the number of transmit beamformer channels relative to receive beamformer channels is reduced. Where the transmit waveformed generators of the transmit beamformer channels are positioned within an ultrasound probe, the space and power requirements of the transmit beamformer channels are reduced based on the reduction in number of transmit segments. Different approaches may be used for reducing the number of transmit channels relative to receive segments. For example, a flexible circuit is connected to one side of a multi-dimensional array and defines transmit segments as groups of two or more elements. A different flexible circuit connects on an opposite side of the elements. The different flexible circuit defines receive segments as individual elements or a fewer number of elements than the transmit segments.

Abstract: Transducer arrays and methods of manufacturing the transducer arrays are provided. A multi-dimensional transducer array is provided where the element-to-element spacing or pitch along one dimension is less than the element spacing or pitch along a second dimension. For example, the element pitch along an azimuth dimension is ½ of the element pitch along an elevation dimension. The multi-dimensional transducer array with the same or different pitch is manufactured from a plurality of modules. Each of the modules are separately diced and then aligned and combined. Separate dicing allows for individual testing of modules prior to assembly as a transducer array. Elements of a transducer array are used for isolating a transmit channel from a receive channel. Rather than a sheet of electrode acting as a ground plane common to a plurality of elements, separate signal lines or traces are provided individually for each element on opposite sides of each element.

Abstract: A method of providing connections to an arrangement of multilayer transducer elements of an ultrasonic transducer array includes patterning an electrically conductive layer on a substrate to define a number of traces and a wide-area continuous region. At least a portion of the substrate is then removed to expose both of the upper and lower surfaces of the wide-area conductive region. The exposed upper and lower surfaces are captured between first and second piezoelectric layers such that the conductive layer electrically contacts both of the piezoelectric layers. The captured wide-area continuous region and at least one of the piezoelectric layers are diced to define the array of transducer elements. The traces that are formed during the patterning step are arranged such that there is a one-to-one correspondence between the traces and the electrodes that are defined by segmenting the wide-area continuous region during the dicing step.

Abstract: An ultrasonic transducer array has a piezoelectric ceramic layer that is separated in a longitudinal direction into n transducer groups. Each group is separated in a transverse direction into m elements. A double-sided flex circuit has a flexible, non-conductive base layer, through which conductive vias extend and are in electrical contact with a respective element. A conductive layer on a bottom side of the flex circuit is divided into a plurality of electrodes, each of which is in electrical contact with a respective one of the elements. For each group, electrically conductive traces connect predetermined ones of the flex circuit electrodes with external driving circuitry, and are located on a top side of the flex circuit. Transducer groups with different numbers of elements are provided, some with 1.5-D operation (with element pairs stimulated via a common trace) and some with 2-D operation (with separate traces for each element).