Abstract: Included within the scope of the invention are plasma etch-resistant films for substrates. The films include a yttria material and a at least a portion of the yttria material is in a crystal phase having an orientation defined by a Miller Index notation {111}. Also included are methods of manufacturing plasma etch-resistant films on a substrate. Such methods include applying a yttria material-containing composition onto at least a portion of a surface of a substrate to form a film. The film includes a yttria material and at least a portion of the yttria material is in a crystal phase having an orientation defined by a Miller Index notation {111}.

Abstract: An apparatus includes a pair of connectors, two or more conductive paths formed in each connector in the pair of connectors, and a shroud encompassing at least a portion of the pair of connectors. The pair of connectors includes a first connector and a second connector. The first connector is substantially more flexible than the second connector, and each connector in the pair of connectors includes a bulkhead. Each of the two or more conductive paths in each connector in the pair of connectors is electrically isolated from all other conductive elements in the pair of connectors. The shroud is located between the bulkheads and disposed about the pair of connectors when the pair of connectors are coupled together electrically.

Abstract: An apparatus includes a pair of connectors, two or more conductive paths formed in each connector in the pair of connectors, and a shroud encompassing at least a portion of the pair of connectors. The pair of connectors includes a first connector and a second connector. The first connector is substantially more flexible than the second connector, and each connector in the pair of connectors includes a bulkhead. Each of the two or more conductive paths in each connector in the pair of connectors is electrically isolated from all other conductive elements in the pair of connectors. The shroud is located between the bulkheads and disposed about the pair of connectors when the pair of connectors are coupled together electrically.

Abstract: The disclosure herein includes rapid gas decompression (RGD)-resistant fluoroelastomeric compositions and includes a curable fluoropolymer having a curesite monomer with at least one functional group capable of curing with a peroxide curative. The compositions include a bisphenyl-based curative and an organic peroxide curative and an organic peroxide co-curative. The fluoroelastomeric compositions have a ratio of the bisphenyl-based curative to the organic peroxide co-curative of about 0.25:1 to about 1.5:1 and a ratio of the bisphenyl-based curative to the organic peroxide of about 0.5:1 to about 1.5:1. Such compositions can be formed into seals meeting RGD industry standards in a variety of sizes, up to and/or exceeding 5 mm in thickness or cross-sectional diameter.

Abstract: Molded articles are described herein having a surface feature thereon, the articles being formed so as to include a polymeric composite material having reinforcing fibers in a polymeric matrix material. The surface feature(s) is created during heat molding of the polymeric composite material to form the article and the surface feature(s) include the polymeric matrix material and the reinforcing fibers therein.