Patents by Inventor Greg Allee

Greg Allee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
    Patent number: 7337522
    Abstract: A method and apparatus for fabricating a three dimensional array of semiconductor chips is disclosed. The method uses a multiple step fabrication process that automates the surface mounting of semiconductor chips with unique chip carriers to achieve the three dimensional array of chips. The method can include the steps of depositing solder on one or more chip modules, placing and interconnecting low-cost components on the chip modules, and storing the preprocessed chip modules in pallets or in a tape and reel. Later these chip carriers may then be mounted on a circuit board, possibly over; for example, low and/or high cost components and then populated with low and/or high cost components. The apparatus includes a unique stackable chip module pallet and print fixture pedestal.
    Type: Grant
    Filed: November 9, 2005
    Date of Patent: March 4, 2008
    Assignee: Legacy Electronics, Inc.
    Inventors: Jason Engle, Rhandee Abrio, Julie Roslyn Bradbury-Bennett, Greg Allee, Kenneth Kledzik
  • Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
    Publication number: 20060107524
    Abstract: A method and apparatus for fabricating a three dimensional array of semiconductor chips is disclosed. The method uses a multiple step fabrication process that automates the surface mounting of semiconductor chips with unique chip carriers to achieve the three dimensional array of chips. The method can include the steps of depositing solder on one or more chip modules, placing and interconnecting low-cost components on the chip modules, and storing the preprocessed chip modules in pallets or in a tape and reel. Later these chip carriers may then be mounted on a circuit board, possibly over; for example, low and/or high cost components and then populated with low and/or high cost components. The apparatus includes a unique stackable chip module pallet and print fixture pedestal.
    Type: Application
    Filed: November 9, 2005
    Publication date: May 25, 2006
    Inventors: Jason Engle, Rhandee Abrio, Julie Bradbury-Bennett, Greg Allee, Kenneth Kledzik