Patents by Inventor Greg Cheng

Greg Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enhanced Wicks for Thermal Ground Planes
    Publication number: 20260036378
    Abstract: A thermal ground plane is disclosed that includes one or more flattened or flattened and deformed mesh disposed within a cavity formed between a top casing and bottom casing. The flattened and deformed mesh, for example, may be created by compressing or flattening mesh such that the pores in the mesh are at least three times smaller than the pores in the mesh prior to flattening. The deformation can be formed to create a plurality of out of plane pillars in the mesh.
    Type: Application
    Filed: August 20, 2025
    Publication date: February 5, 2026
    Applicant: Kelvin Thermal Technologies, Inc.
    Inventors: Ryan Lewis, Hunter Hach, Hunter Anderson, Jason W. West, Dylan McNally, Sean Liao, Ray Wu, Greg Cheng, Yung-Cheng Lee
  • Tube-In-Tube Heat Pipe
    Publication number: 20250129993
    Abstract: A tube-in-tube heat pipe is disclosed. A tube-in-tube heat pipe can include an outer tube having a cylindrical shape that extends from a first end to a second end and having an outer tube chamber. The outer tube can be sealed at the first and the second end. The tube-in-tube heat pipe can also include an inner tube having a cylindrical shape and disposed within the outer tube. The inner tube comprising a porous material surrounding an inner volume. The inner tube is disposed within the outer tube chamber.
    Type: Application
    Filed: April 30, 2024
    Publication date: April 24, 2025
    Inventors: Ryan Lewis, Daniel Katzman, Greg Cheng, Yung-Cheng Lee