Patents by Inventor Greg Eyck

Greg Eyck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080003778
    Abstract: A method of bonding two substrates and a corresponding bonded structure are described. The method includes forming a first nanostructure layer comprising nanostructures on a first substrate. A second substrate is contacted with the first nanostructure layer. The first nanostructure layer is heated at a heating temperature below a melting temperature of the first and second substrates. The first nanostructure layer is cooled after heating the nanostructure layer such that the first substrate is bonded to the second substrate.
    Type: Application
    Filed: June 12, 2007
    Publication date: January 3, 2008
    Inventors: Greg Eyck, Toh-Ming Lu, Tansel Karabacak, Dexian Ye, Pei-I Wang