Abstract: The present invention provides a sensor package, wherein the sensor package comprises a leadless frame having a plurality of inner leads and a plurality of external leads, a molded structure forming an open cavity, wherein the leadless frame forms the bottom of the open cavity, and wherein the plurality of external leads expose to the outside of the open cavity and the plurality of inner leads expose to the inside of the open cavity, a sensor die attached to the bottom of the open cavity, a plurality of bond wires electrically connecting the sensor die with the plurality of inner leads, and a filler gel filling the open cavity to encapsulate the sensor die and bond wires.