Patents by Inventor Greg Halac

Greg Halac has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Moisture barrier for semiconductor structures with stress relief
    Patent number: 9576920
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes an electrically conductive layer disposed over a substrate. A moisture barrier layer is disposed over the substrate and between the substrate and the electrically conductive layer. A dielectric layer is disposed over the moisture barrier layer. The dielectric layer has an elastic modulus that is lower than an elastic modulus of the moisture barrier layer.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: February 21, 2017
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Jonathan Abrokwah, Forest Dixon, Thomas Dungan, Greg Halac, Rick Snyder
  • Moisture barrier for semiconductor structures with stress relief
    Patent number: 9508661
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes an electrically conductive layer disposed over a substrate. A moisture barrier layer is disposed over the substrate and between the substrate and the electrically conductive layer. A dielectric layer is disposed over the moisture barrier layer. The dielectric layer has an elastic modulus that is lower than an elastic modulus of the moisture barrier layer.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: November 29, 2016
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Jonathan Abrokwah, Forest Dixon, Thomas Dungan, Greg Halac, Rick Snyder
  • MOISTURE BARRIER FOR SEMICONDUCTOR STRUCTURES WITH STRESS RELIEF
    Publication number: 20160336284
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes an electrically conductive layer disposed over a substrate. A moisture barrier layer is disposed over the substrate and between the substrate and the electrically conductive layer. A dielectric layer is disposed over the moisture barrier layer. The dielectric layer has an elastic modulus that is lower than an elastic modulus of the moisture barrier layer.
    Type: Application
    Filed: July 25, 2016
    Publication date: November 17, 2016
    Inventors: Jonathan Abrokwah, Forest Dixon, Thomas Dungan, Greg Halac, Rick Snyder
  • MOISTURE BARRIER FOR SEMICONDUCTOR STRUCTURES WITH STRESS RELIEF
    Publication number: 20160020179
    Abstract: A semiconductor structure is disclosed. The semiconductor structure includes an electrically conductive layer disposed over a substrate. A moisture barrier layer is disposed over the substrate and between the substrate and the electrically conductive layer. A dielectric layer is disposed over the moisture barrier layer. The dielectric layer has an elastic modulus that is lower than an elastic modulus of the moisture barrier layer.
    Type: Application
    Filed: July 17, 2014
    Publication date: January 21, 2016
    Inventors: Jonathan Abrokwah, Forest Dixon, Thomas Dungan, Greg Halac, Rick Snyder