Patents by Inventor Greg Hames

Greg Hames has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12205827
    Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: January 21, 2025
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne
  • Publication number: 20210043465
    Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
    Type: Application
    Filed: October 27, 2020
    Publication date: February 11, 2021
    Inventors: Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne
  • Patent number: 10832921
    Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: November 10, 2020
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne
  • Publication number: 20190279882
    Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
    Type: Application
    Filed: May 28, 2019
    Publication date: September 12, 2019
    Inventors: Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne
  • Patent number: 10304697
    Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: May 28, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne
  • Publication number: 20190109018
    Abstract: An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
    Type: Application
    Filed: October 5, 2017
    Publication date: April 11, 2019
    Inventors: Devarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne
  • Patent number: 10157872
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing a semiconductor device comprising forming interconnection structures by at least part performing a lateral plating process, and a semiconductor device manufactured thereby.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: December 18, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Greg Hames, Glenn Rinne, Devarajan Balaraman
  • Publication number: 20180323161
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing a semiconductor device comprising forming interconnection structures by at least part performing a lateral plating process, and a semiconductor device manufactured thereby.
    Type: Application
    Filed: July 13, 2018
    Publication date: November 8, 2018
    Inventors: Greg Hames, Glenn Rinne, Devarajan Balaraman
  • Patent number: 10037957
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing a semiconductor device comprising forming interconnection structures by at least part performing a lateral plating process, and a semiconductor device manufactured thereby.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: July 31, 2018
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Greg Hames, Glenn Rinne, Devarajan Balaraman
  • Publication number: 20180138138
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing a semiconductor device comprising forming interconnection structures by at least part performing a lateral plating process, and a semiconductor device manufactured thereby.
    Type: Application
    Filed: November 14, 2016
    Publication date: May 17, 2018
    Inventors: Greg Hames, Glenn Rinne, Devarajan Balaraman
  • Patent number: 8887382
    Abstract: The invention relates to a pendulous accelerometer including a pendulous electrode formed in a substrate, at least one counter electrode, and an encapsulation cover. The at least one counter electrode is formed under the cover, and spacers are positioned between the cover and the substrate.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: November 18, 2014
    Assignee: MEMSCAP
    Inventors: Béatrice Wenk, Jean-Francois Veneau, Greg Hames
  • Publication number: 20090145227
    Abstract: The invention relates to a pendulous accelerometer including a pendulous electrode formed in a substrate, at least one counter electrode, and an encapsulation cover. The at least one counter electrode is formed under the cover, and spacers are positioned between the cover and the substrate.
    Type: Application
    Filed: December 5, 2008
    Publication date: June 11, 2009
    Applicant: MEMSCAP
    Inventors: Beatrice Wenk, Jean-Francois Veneau, Greg Hames