Abstract: An integrated optical module for an optical scanner has a lens spaced from a vertical-cavity surface-emitting laser (VCSEL) by a spacer of defined dimensions. The module, in an alternative embodiment, includes a wafer frame, a suspended mirror mounted for oscillation on the frame, a wafer substrate bonded beneath the frame and a wafer cover bonded above the frame. The cover includes a mirror travel stop to protect the mirror against shocks. A VCSEL mounted to the wafer cover produces a beam which is shaped and deflected by a diffractive optical element onto the oscillating mirror. The reflected beam passes out of the module toward an indicia to be read. Large numbers of such devices may be fabricated relatively cheaply using wafer-scale processing and assembly technology. Three large wafers are fabricated corresponding respectively to arrays of substrates, frames and covers. The large wafers are bonded together in a sandwich arrangement, and are then diced to produce the individual scan modules.