Patents by Inventor Greg Nowling

Greg Nowling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9159683
    Abstract: Methods for etching copper in the fabrication of integrated circuits are disclosed. In one exemplary embodiment, a method for fabricating an integrated circuit includes providing an integrated circuit structure including a copper bump structure and a copper seed layer underlying and adjacent to the copper bump structure and etching the seed layer selective to the copper bump structure using a wet etching chemistry consisting of H3PO4 in a volume percentage of about 0.07 to about 0.36, H2O2 in a volume percentage of about 0.1 to about 0.7, and a remainder of H2O, and optionally NH4OH.
    Type: Grant
    Filed: February 10, 2014
    Date of Patent: October 13, 2015
    Assignees: GLOBALFOUNDRIES, INC., INTERMOLECULAR, INC.
    Inventors: Reiner Willeke, Tanya Atanasova, Anh Duong, Greg Nowling
  • Publication number: 20150228595
    Abstract: Methods for etching copper in the fabrication of integrated circuits are disclosed. In one exemplary embodiment, a method for fabricating an integrated circuit includes providing an integrated circuit structure including a copper bump structure and a copper seed layer underlying and adjacent to the copper bump structure and etching the seed layer selective to the copper bump structure using a wet etching chemistry consisting of H3PO4 in a volume percentage of about 0.07 to about 0.36, H2O2 in a volume percentage of about 0.1 to about 0.7, and a remainder of H2O, and optionally NH4OH.
    Type: Application
    Filed: February 10, 2014
    Publication date: August 13, 2015
    Applicants: Intermolecular Inc., GLOBALFOUNDRIES Inc.
    Inventors: Reiner Willeke, Tanya Atanasova, Anh Duong, Greg Nowling