Patents by Inventor Greg Sadowski

Greg Sadowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11842199
    Abstract: An asynchronous pipeline includes a first stage and one or more second stages. A controller provides control signals to the first stage to indicate a modification to an operating speed of the first stage. The modification is determined based on a comparison of a completion status of the first stage to one or more completion statuses of the one or more second stages. In some cases, the controller provides control signals indicating modifications to an operating voltage applied to the first stage and a drive strength of a buffer in the first stage. Modules can be used to determine the completion statuses of the first stage and the one or more second stages based on the monitored output signals generated by the stages, output signals from replica critical paths associated with the stages, or a lookup table that indicates estimated completion times.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: December 12, 2023
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Greg Sadowski, John Kalamatianos, Shomit N. Das
  • Patent number: 11775349
    Abstract: One or more processors are operative to carry out neural network operations and include a plurality of compute units (CUs) configurable for neural network operations. The neural network compute unit remapping logic detects a condition to remap neural network compute units that are currently used in carrying out a neural network operation in a processor with at least one replacement compute unit that is not currently being used to carry out the neural network operation. In response to detecting the condition, the logic remaps a logical address of at least one currently used compute unit to a different physical address that corresponds to the replacement compute unit and causes the replacement compute unit to carry out neural network operations.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: October 3, 2023
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventor: Greg Sadowski
  • Patent number: 11742038
    Abstract: Exemplary embodiments provide wear spreading among die regions (i.e., one or more circuits) in an integrated circuit or among dies by using operating condition data in addition to or instead of environmental data such as temperature data, from each of a plurality of die regions. Control logic produces a cumulative amount of time each of the plurality of die regions has spent at an operating condition based on operating condition data wherein the operating condition data is based on at least one of the following operating characteristics: frequency of operation of the plurality of die regions, an operating voltage of the plurality of die regions, an activity level of the plurality of die regions, a timing margin of the plurality of die regions, and a number of detected faults of the plurality of die regions. The method and apparatus spreads wear among the plurality of same type of die regions by controlling task execution among the plurality of die regions using the die wear-out data.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: August 29, 2023
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Steven Raasch, Greg Sadowski, David A. Roberts
  • Patent number: 11709536
    Abstract: A multi-die semiconductor package includes a first integrated circuit (IC) die having a first intrinsic performance level and a second IC die having a second intrinsic performance level different from the first intrinsic performance level. A power management controller distributes, based on a determined die performance differential between the first IC die and the second IC die, a level of power allocated to the semiconductor chip package between the first IC die and the second IC die. In this manner, the first IC die receives and operates at a first level of power resulting in performance exceeding its intrinsic performance level. The second IC die receives and operates at a second level of power resulting in performance below its intrinsic performance level, thereby reducing performance differentials between the IC dies.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: July 25, 2023
    Assignees: Advanced Micro Devices, Inc., ATI TECHNOLOGIES ULC
    Inventors: Greg Sadowski, Sriram Sundaram, Stephen Kushnir, William C. Brantley, Michael J. Schulte
  • Patent number: 11658681
    Abstract: Various energy efficient data encoding schemes and computing devices are disclosed. In one aspect, a method of transmitting data from a transmitter to a receiver connected by plural wires is provided. The method includes sending from the transmitter on at least one but not all of the wires a first wave form that has first and second signal transitions. The receiver receives the first waveform and measures a first duration between the first and second signal transitions using a locally generated clock signal not received from the transmitter. The first duration is indicative of a first particular data value.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: May 23, 2023
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Greg Sadowski, John Kalamatianos
  • Publication number: 20230154555
    Abstract: Exemplary embodiments provide wear spreading among die regions (i.e., one or more circuits) in an integrated circuit or among dies by using operating condition data in addition to or instead of environmental data such as temperature data, from each of a plurality of die regions. Control logic produces a cumulative amount of time each of the plurality of die regions has spent at an operating condition based on operating condition data wherein the operating condition data is based on at least one of the following operating characteristics: frequency of operation of the plurality of die regions, an operating voltage of the plurality of die regions, an activity level of the plurality of die regions, a timing margin of the plurality of die regions, and a number of detected faults of the plurality of die regions. The method and apparatus spreads wear among the plurality of same type of die regions by controlling task execution among the plurality of die regions using the die wear-out data.
    Type: Application
    Filed: January 13, 2023
    Publication date: May 18, 2023
    Inventors: STEVEN RAASCH, GREG SADOWSKI, DAVID A. ROBERTS
  • Patent number: 11650650
    Abstract: A processing unit includes a plurality of components configured to execute instructions and a controller. The controller is configured to determine a power consumption of the processing unit, determine a waiting status of the processing unit based on waiting statuses of components, and selectively modify an operating state of the processing unit based on the waiting status and the power consumption of the processing unit. In some cases, the operating state is modified in response to a percentage of the components that are waiting for an action to complete being below a threshold percentage and the power consumption of the processing unit being below a power limit. In some cases, the controller identifies a pattern in the power consumption by the processing unit and modifies the operating state of the processing unit to increase the power consumption of the processing unit based on the pattern identified by the controller.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: May 16, 2023
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Greg Sadowski
  • Publication number: 20230143622
    Abstract: Exemplary embodiments provide thermal wear spreading among a plurality of thermal die regions in an integrated circuit or among dies by using die region wear-out data that represents a cumulative amount of time each of a number of thermal die regions in one or more dies has spent at a particular temperature level. In one example, die region wear-out data is stored in persistent memory and is accrued over a life of each respective thermal region so that a long term monitoring of temperature levels in the various die regions is used to spread thermal wear among the thermal die regions. In one example, spreading thermal wear is done by controlling task execution such as thread execution among one or more processing cores, dies and/or data access operations for a memory.
    Type: Application
    Filed: January 9, 2023
    Publication date: May 11, 2023
    Inventors: DAVID A. ROBERTS, GREG SADOWSKI, STEVEN RAASCH
  • Patent number: 11551990
    Abstract: Exemplary embodiments provide thermal wear spreading among a plurality of thermal die regions in an integrated circuit or among dies by using die region wear-out data that represents a cumulative amount of time each of a number of thermal die regions in one or more dies has spent at a particular temperature level. In one example, die region wear-out data is stored in persistent memory and is accrued over a life of each respective thermal region so that a long term monitoring of temperature levels in the various die regions is used to spread thermal wear among the thermal die regions. In one example, spreading thermal wear is done by controlling task execution such as thread execution among one or more processing cores, dies and/or data access operations for a memory.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: January 10, 2023
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: David A. Roberts, Greg Sadowski, Steven Raasch
  • Publication number: 20230004204
    Abstract: Systems, apparatuses, and methods for managing power consumption for a neural network implemented on multiple graphics processing units (GPUs) are disclosed. A computing system includes a plurality of GPUs implementing a neural network. In one implementation, the plurality of GPUs draw power from a common power supply. To prevent the power consumption of the system from exceeding a power limit for long durations, the GPUs coordinate the scheduling of tasks of the neural network. At least one or more first GPUs schedule their computation tasks so as not to overlap with the computation tasks of one or more second GPUs. In this way, the system spends less time consuming power in excess of a power limit, allowing the neural network to be implemented in a more power efficient manner.
    Type: Application
    Filed: August 30, 2022
    Publication date: January 5, 2023
    Inventor: Greg Sadowski
  • Patent number: 11435813
    Abstract: Systems, apparatuses, and methods for managing power consumption for a neural network implemented on multiple graphics processing units (GPUs) are disclosed. A computing system includes a plurality of GPUs implementing a neural network. In one implementation, the plurality of GPUs draw power from a common power supply. To prevent the power consumption of the system from exceeding a power limit for long durations, the GPUs coordinate the scheduling of tasks of the neural network. At least one or more first GPUs schedule their computation tasks so as not to overlap with the computation tasks of one or more second GPUs. In this way, the system spends less time consuming power in excess of a power limit, allowing the neural network to be implemented in a more power efficient manner.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: September 6, 2022
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Greg Sadowski
  • Patent number: 11436486
    Abstract: Systems, apparatuses, and methods for optimizing neural network training with a first-in, last-out (FILO) buffer are disclosed. A processor executes a training run of a neural network implementation by performing multiple passes and adjusting weights of the neural network layers on each pass. Each training phase includes a forward pass and a backward pass. During the forward pass, each layer, in order from first layer to last layer, stores its weights in the FILO buffer. An error is calculated for the neural network at the end of the forward pass. Then, during the backward pass, each layer, in order from last layer to first layer, retrieves the corresponding weights from the FILO buffer. Gradients are calculated based on the error so as to update the weights of the layer for the next pass through the neural network.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: September 6, 2022
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Greg Sadowski
  • Publication number: 20220187901
    Abstract: An apparatus includes a plurality of registers to store sets of state information that represent a state history of a processing unit. The apparatus also includes a power management advisor (PMA) to generate a signal based on the sets of state information, wherein the signal indicates a probability that a power state transition of the processing unit achieves a target outcome. In some cases, the signal is provided to a power management controller including hardware circuitry that initiates a power state transition of the processing unit based on the signal and inputs to the power management controller that represent a subset of the state information corresponding to a current power state of the processing unit.
    Type: Application
    Filed: March 4, 2022
    Publication date: June 16, 2022
    Inventors: Greg SADOWSKI, Ying CHEN
  • Publication number: 20220187896
    Abstract: A processing unit includes a plurality of components configured to execute instructions and a controller. The controller is configured to determine a power consumption of the processing unit, determine a waiting status of the processing unit based on waiting statuses of components, and selectively modify an operating state of the processing unit based on the waiting status and the power consumption of the processing unit. In some cases, the operating state is modified in response to a percentage of the components that are waiting for an action to complete being below a threshold percentage and the power consumption of the processing unit being below a power limit. In some cases, the controller identifies a pattern in the power consumption by the processing unit and modifies the operating state of the processing unit to increase the power consumption of the processing unit based on the pattern identified by the controller.
    Type: Application
    Filed: January 4, 2022
    Publication date: June 16, 2022
    Inventor: Greg Sadowski
  • Patent number: 11275430
    Abstract: An apparatus includes a plurality of registers to store sets of state information that represent a state history of a processing unit. The apparatus also includes a power management advisor (PMA) to generate a signal based on the sets of state information, wherein the signal indicates a probability that a power state transition of the processing unit achieves a target outcome. In some cases, the signal is provided to a power management controller including hardware circuitry that initiates a power state transition of the processing unit based on the signal and inputs to the power management controller that represent a subset of the state information corresponding to a current power state of the processing unit.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: March 15, 2022
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Greg Sadowski, Ying Chen
  • Patent number: 11216052
    Abstract: A processing unit includes a plurality of components configured to execute instructions and a controller. The controller is configured to determine a power consumption of the processing unit, determine a waiting status of the processing unit based on waiting statuses of components, and selectively modify an operating state of the processing unit based on the waiting status and the power consumption of the processing unit. In some cases, the operating state is modified in response to a percentage of the components that are waiting for an action to complete being below a threshold percentage and the power consumption of the processing unit being below a power limit. In some cases, the controller identifies a pattern in the power consumption by the processing unit and modifies the operating state of the processing unit to increase the power consumption of the processing unit based on the pattern identified by the controller.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: January 4, 2022
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventor: Greg Sadowski
  • Publication number: 20210405722
    Abstract: A multi-die semiconductor package includes a first integrated circuit (IC) die having a first intrinsic performance level and a second IC die having a second intrinsic performance level different from the first intrinsic performance level. A power management controller distributes, based on a determined die performance differential between the first IC die and the second IC die, a level of power allocated to the semiconductor chip package between the first IC die and the second IC die. In this manner, the first IC die receives and operates at a first level of power resulting in performance exceeding its intrinsic performance level. The second IC die receives and operates at a second level of power resulting in performance below its intrinsic performance level, thereby reducing performance differentials between the IC dies.
    Type: Application
    Filed: September 23, 2020
    Publication date: December 30, 2021
    Inventors: Greg SADOWSKI, Sriram SUNDARAM, Stephen KUSHNIR, William C. BRANTLEY, Michael J. SCHULTE
  • Publication number: 20210320672
    Abstract: Various energy efficient data encoding schemes and computing devices are disclosed. In one aspect, a method of transmitting data from a transmitter to a receiver connected by plural wires is provided. The method includes sending from the transmitter on at least one but not all of the wires a first wave form that has first and second signal transitions. The receiver receives the first waveform and measures a first duration between the first and second signal transitions using a locally generated clock signal not received from the transmitter. The first duration is indicative of a first particular data value.
    Type: Application
    Filed: June 15, 2021
    Publication date: October 14, 2021
    Inventors: GREG SADOWSKI, JOHN KALAMATIANOS
  • Patent number: 11119549
    Abstract: Control of power supplied to a machine intelligence (MI) processor is provided with an energy reservoir and power switching circuitry coupled to a power supply, the energy reservoir, and to power delivery circuitry of the MI processor. Control circuitry directs the power switching circuitry to charge the energy reservoir from the power supply or discharge the energy reservoir to the MI processor based on MI state information obtained from the MI processor. Processes for charging and discharging such an energy reservoir are provided. Processes for analyzing state information of the MI processor and configuring the control circuitry are also provided.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: September 14, 2021
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Greg Sadowski
  • Patent number: 11061429
    Abstract: A technique for fine-granularity speed binning for a processing device is provided. The processing device includes a plurality of clock domains, each of which may be clocked with independent clock signals. The clock frequency at which a particular clock domain may operate is determined based on the longest propagation delay between clocked elements in that particular clock domain. The processing device includes measurement circuits for each clock domain that measure such propagation delay. The measurement circuits are replica propagation delay paths of actual circuit elements within each particular clock domain. A speed bin for each clock domain is determined based on the propagation delay measured for the measurement circuits for a particular clock domain. Specifically, a speed bin is chosen that is associated with the fastest clock speed whose clock period is longer than the slowest propagation delay measured for the measurement circuit for the clock domain.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: July 13, 2021
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Greg Sadowski, Shomit N. Das