Patents by Inventor Gregg B. Monjeau
Gregg B. Monjeau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10014273Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.Type: GrantFiled: July 21, 2016Date of Patent: July 3, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas E. Lombardi, Donald Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran
-
Publication number: 20160329297Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.Type: ApplicationFiled: July 21, 2016Publication date: November 10, 2016Inventors: Thomas E. LOMBARDI, Donald MERTE, Gregg B. MONJEAU, David L. QUESTAD, Son K. TRAN
-
Patent number: 9455234Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.Type: GrantFiled: March 18, 2014Date of Patent: September 27, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas E. Lombardi, Donald Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran
-
Patent number: 9089052Abstract: A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.Type: GrantFiled: November 25, 2014Date of Patent: July 21, 2015Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Shidong Li, Gregg B. Monjeau, Kamal K. Sikka, Hilton T. Toy, Thomas Weiss
-
Patent number: 9089051Abstract: A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.Type: GrantFiled: June 27, 2013Date of Patent: July 21, 2015Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Shidong Li, Gregg B. Monjeau, Kamal K. Sikka, Hilton T. Toy, Thomas Weiss
-
Publication number: 20150077944Abstract: A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.Type: ApplicationFiled: November 25, 2014Publication date: March 19, 2015Inventors: Shidong Li, Gregg B. Monjeau, Kamal K. Sikka, Hilton T. Toy, Thomas Weiss
-
Publication number: 20150001701Abstract: A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.Type: ApplicationFiled: June 27, 2013Publication date: January 1, 2015Inventors: Shidong Li, Gregg B. Monjeau, Kamal K. Sikka, Hilton T. Toy, Thomas Weiss
-
Publication number: 20140197228Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.Type: ApplicationFiled: March 18, 2014Publication date: July 17, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas E. LOMBARDI, Donald MERTE, Gregg B. MONJEAU, David L. QUESTAD, Son K. TRAN
-
Patent number: 8759151Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.Type: GrantFiled: March 16, 2012Date of Patent: June 24, 2014Assignee: International Business Machines CorporationInventors: Thomas E. Lombardi, Donald Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran
-
Patent number: 8232636Abstract: A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.Type: GrantFiled: January 26, 2010Date of Patent: July 31, 2012Assignee: International Business Machines CorporationInventors: James N Humenik, Sushumna Iruvanti, Richard Langlois, Hsichang Liu, Govindarajan Natarajan, Kamal K Sikka, Hilton T Toy, Jiantao Zheng, Gregg B Monjeau, Mark Kapfhammer
-
Publication number: 20120187180Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.Type: ApplicationFiled: March 16, 2012Publication date: July 26, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas E. LOMBARDI, Donald MERTE, Gregg B. MONJEAU, David L. QUESTAD, Son K. TRAN
-
Patent number: 8188597Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.Type: GrantFiled: September 22, 2010Date of Patent: May 29, 2012Assignee: International Business Machines CorporationInventors: Thomas E. Lombardi, Donald Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran
-
Publication number: 20120070940Abstract: A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.Type: ApplicationFiled: September 22, 2010Publication date: March 22, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas E. Lombardi, Donald Merte, Gregg B. Monjeau, David L. Questad, Son K. Tran
-
Publication number: 20110180923Abstract: A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.Type: ApplicationFiled: January 26, 2010Publication date: July 28, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: JAMES N. HUMENIK, SUSHUMNA IRUVANTI, RICHARD LANGLOIS, HSICHANG LIU, GOVINDARAJAN NATARAJAN, KAMAL K. SIKKA, HILTON T. TOY, JIANTAO ZHENG, GREGG B. MONJEAU, MARK KAPFHAMMER
-
Patent number: 6682872Abstract: Radiation-curable compositions are provided for use in the fabrication of electronic components as passivation coatings; for defect repair in ceramic and thin film products by micropassivation in high circuit density electronic modules to allow product recovery; as a solder mask in electronic assembly processes; for use as protective coatings on printed circuit board (PCB) circuitry and electronic devices against mechanical damage and corrosion from exposure to the environment. The compositions are solvent-free, radiation-curable, preferably uv-curable, containing a polymer binder, which is a pre-formed thermoplastic or elastomeric polymer/oligomer, a monofunctional and/or bifunctional acrylic monomer, a multifunctional (more than 2 reactive groups) acrylated/methacrylated monomer, and a photoinitiator, where all the constituents are mutually miscible forming a homogeneous viscous blend without the addition of an organic solvent. The compositions may also contain inorganic fillers and/or nanoparticle fillers.Type: GrantFiled: January 22, 2002Date of Patent: January 27, 2004Assignee: International Business Machines CorporationInventors: Krishna G. Sachdev, Michael Berger, Rebecca Y. Gorrell, Gregg B. Monjeau, Bernadette H. Perry, Thomas A. Wassick
-
Publication number: 20030138733Abstract: Radiation-curable compositions are provided for use in the fabrication of electronic components as passivation coatings; for defect repair in ceramic and thin film products by micropassivation in high circuit density electronic modules to allow product recovery; as a solder mask in electronic assembly processes; for use as protective coatings on printed circuit board (PCB) circuitry and electronic devices against mechanical damage and corrosion from exposure to the environment. The compositions are solvent-free, radiation-curable, preferably uv-curable, containing a polymer binder, which is a pre-formed thermoplastic or elastomeric polymer/oligomer, a monofunctional and/or bifunctional acrylic monomer, a multifunctional (more than 2 reactive groups) acrylated/methacrylated monomer, and a photoinitiator, where all the constituents are mutually miscible forming a homogeneous viscous blend without the addition of an organic solvent. The compositions may also contain inorganic fillers and/or nanoparticle fillers.Type: ApplicationFiled: January 22, 2002Publication date: July 24, 2003Applicant: International Business Machines CorporationInventors: Krishna G. Sachdev, Michael Berger, Rebecca Y. Gorrell, Gregg B. Monjeau, Bernadette H. Perry, Thomas A. Wassick
-
Patent number: 5985128Abstract: A method for preforming electrochemical processes requiring the application of electricity on features of a substrate includes shorting out the features using a shorting layer across connectors to which the features a in electrical communication. Electricity is then applied and the process is performed.Type: GrantFiled: May 5, 1999Date of Patent: November 16, 1999Assignee: International Business Machines CorporationInventors: Shaji Farooq, Suryanarayana Kaja, Hsichang Liu, Karen P. McLaughlin, Gregg B. Monjeau, Kim Hulett Ruffing
-
Patent number: 5935404Abstract: A method of performing electrochemistry processes on features and connectors of a substrate includes the application of a shorting layer across the connectors which are in electrical contact with the features, thereby shorting the features and creating an assemblage for which electricity is applied.Type: GrantFiled: January 22, 1997Date of Patent: August 10, 1999Assignee: International Business Machines CorporationInventors: Shaji Farooq, Suryanarayana Kaja, Hsichang Liu, Karen P. McLaughlin, Gregg B. Monjeau, Kim Hulett Ruffing
-
Patent number: 5284286Abstract: A porous metal block for selectively removing solder or braze from a substrate is disclosed. The block comprises a plurality of protrusions which absorb solder or braze through capillary action. The number and dimensions of the protrusions vary depending on the application. Also disclosed is a process for making such a block involving a unique two steps sintering process.Type: GrantFiled: October 31, 1991Date of Patent: February 8, 1994Assignee: International Business Machines CorporationInventors: Peter J. Brofman, Shaji Farooq, Kathleen A. Lidestri, Gregg B. Monjeau, Karl J. Puttlitz
-
Patent number: 5219520Abstract: A porous metal block for selectively removing solder or braze from a substrate is disclosed. The block comprises a plurality of protrusions which absorb solder or braze through capillary action. The number and dimensions of the protrusions vary depending on the application. Also disclosed is a process for making such a block involving a unique two steps sintering process.Type: GrantFiled: July 14, 1992Date of Patent: June 15, 1993Assignee: International Business Machines CorporationInventors: Peter J. Brofman, Shaji Farooq, Kathleen A. Lidestri, Gregg B. Monjeau, Karl J. Puttlitz