Abstract: Methods, and a program storage device for executing such methods, for performing model-based optical proximity correction by providing a mask matrix having a region of interest (ROI) and locating a plurality of points of interest within the mask matrix. A first polygon having a number of vertices representative of the located points of interest is computed, followed by determining a spatial relation between its vertices and the ROI. The vertices of the first polygon are then pinned to boundaries of and within the ROI such that a second polygon is formed on the ROI. The process is repeated for all vertices of the first polygon such that the second polygon is collapsed onto the ROI. This collapsed second polygon is then used to correct for optical proximity.

Abstract: Methods, and program storage devices, for performing model-based optical proximity correction by providing a region of interest (ROI) having an interaction distance and locating at least one polygon within the ROI. A cut line of sample points representative of a set of vertices, or plurality of cut lines, are generated within the ROI across at least one lateral edge of the polygon(s). An angular position, and first and second portions of the cut line residing on opposing sides of an intersection between the cut line and the lateral edge of the polygon are determined, followed by generating a new ROI by extending the original ROI beyond its interaction distance based on such angular position, and first and second portions of the cut line. In this manner, a variety of new ROIs may be generated, in a variety of different directions, to ultimately correct for optical proximity.

Abstract: Methods, and a program storage device for executing such methods, for performing model-based optical proximity correction by providing a mask matrix having a region of interest (ROI) and locating a plurality of points of interest within the mask matrix. A first polygon having a number of vertices representative of the located points of interest is computed, followed by determining a spatial relation between its vertices and the ROI. The vertices of the first polygon are then pinned to boundaries of and within the ROI such that a second polygon is formed on the ROI. The process is repeated for all vertices of the first polygon such that the second polygon is collapsed onto the ROI. This collapsed second polygon is then used to correct for optical proximity.

Abstract: A method for determining an image of a patterned object formed by a polychromatic lithographic projection system having a laser radiation source of a finite spectral bandwidth and a lens for imaging the patterned object to an image plane within a resist layer. The method comprises providing patterns for the object, a spectrum of the radiation source to be used in the lithographic projection system, an intensity and polarization distribution of the radiation source, and a lens impulse response in the spatial domain or in the spatial frequency domain of the image. The method then includes forming a polychromatic 4D bilinear vector kernel comprising a partially coherent polychromatic joint response between pairs of points in the spatial domain or in the spatial frequency domain, determining the dominant polychromatic 2D kernels of the polychromatic 4D bilinear vector kernel, and determining the image of the patterned object from convolutions of the object patterns with the dominant polychromatic 2D kernels.

Abstract: Disclosed is an interferometry analysis method that includes comparing information derivable from multiple interferometry signals corresponding to different surface locations of a test object to information corresponding to multiple models of the test object, wherein the multiple models are parameterized by a series of characteristics that relate to one or more under-resolved lateral features of the test object; and outputting information about the under-resolved surface feature based on the comparison.

Abstract: Methods, and program storage devices, for performing model-based optical lithography corrections by partitioning a cell array layout, having a plurality of polygons thereon, into a plurality of cells covering the layout. This layout is representative of a desired design data hierarchy. A density map is then generated corresponding to interactions between the polygons and plurality of cells, and then the densities within each cell are convolved. An interaction map is formed using the convolved densities, followed by truncating the interaction map to form a map of truncated cells. Substantially identical groupings of the truncated cells are then segregated respectively into differing ones of a plurality of buckets, whereby each of these buckets comprise a single set of identical groupings of truncated cells. A hierarchal arrangement is generated using these buckets, and the desired design data hierarchy enforced using the hierarchal arrangement to ultimately correct for optical lithography.

Abstract: A method is described for performing model-based optical proximity corrections on a mask layout used in an optical lithography process having a plurality of mask shapes. Model-based optical proximity correction is performed by computing the image intensity on selected evaluation points on the mask layout. The image intensity to be computed includes optical flare and stray light effects due to the interactions between the shapes on the mask layout. The computation of the image intensity involves sub-dividing the mask layout into a plurality of regions, each region at an increasing distance from the evaluation point. The contributions of the optical flare and stray light effects due to mask shapes in each of the regions are then determined. Finally, all the contributions thus obtained are combined to obtain the final computation of the image intensity at the selected point.

Abstract: An efficient method and system is provided for computing lithographic images that takes into account vector effects such as lens birefringence, resist stack effects and tailored source polarizations, and may also include blur effects of the mask and the resist. These effects are included by forming a generalized bilinear kernel, which is independent of the mask transmission function, which can then be treated using a decomposition to allow rapid computation of an image that includes such non-scalar effects. Dominant eigenfunctions of the generalized bilinear kernel can be used to pre-compute convolutions with possible polygon sectors. A mask transmission function can then be decomposed into polygon sectors, and weighted pre-images may be formed from a coherent sum of the pre-computed convolutions for the appropriate mask polygon sectors. The image at a point may be formed from the incoherent sum of the weighted pre-images over all of the dominant eigenfunctions of the generalized bilinear kernel.

Abstract: A method for optimizing the number of kernels N used in a sum of coherent sources (SOCS) for optical proximity correction in an optical microlithography process including setting the number of kernels N to a predetermined minimum value Nmin. A determination is made as to whether an accuracy estimate of calculated intensity is within a tolerable value. A determination is also made as to whether an added X/Y asymmetry estimate of the calculated intensity is negligible.

Abstract: A method for calculating long-range image contributions from mask polygons. An algorithm is introduced having application to Optical Proximity Correction in optical lithography. A finite integral for each sector of a polygon replaces an infinite integral. Integrating over two triangles, rather than integrating on the full sector, achieves a finite integral. An analytical approach is presented for a power law kernel to reduce the numerical integration of a sector to an analytical expression evaluation. The mask polygon is divided into regions to calculate interaction effects, such as intermediate-range and long-range effects, by truncating the mask instead of truncating the kernel function.

Abstract: A first method to compute a phase map within an optical proximity correction simulation kernel utilizes simulated wavefront information from randomly generated data. A second method uses measured data from optical tools. A phase map is created by analytically embedding a randomly generated two-dimensional array of complex numbers of wavefront information, and performing an inverse Fourier Transform on the resultant array. A filtering function requires the amplitude of each element of the array to be multiplied by a Gaussian function. A power law is then applied to the array. The elements of the array are shuffled, and converted from the phasor form to real/imaginary form. A two-dimensional Fast Fourier Transform is applied. The array is then unshuffled, and converted back to phasor form.

Abstract: Methods, and program storage devices, for performing model-based optical proximity correction by providing a region of interest (ROI) having an interaction distance and locating at least one polygon within the ROI. A cut line of sample points representative of a set of vertices, or plurality of cut lines, are generated within the ROI across at least one lateral edge of the polygon(s). An angular position, and first and second portions of the cut line residing on opposing sides of an intersection between the cut line and the lateral edge of the polygon are determined, followed by generating a new ROI by extending the original ROI beyond its interaction distance based on such angular position, and first and second portions of the cut line. In this manner, a variety of new ROIs may be generated, in a variety of different directions, to ultimately correct for optical proximity.

Abstract: Methods, and a program storage device for executing such methods, for performing model-based optical proximity correction by providing a mask matrix having a region of interest (ROI) and locating a plurality of points of interest within the mask matrix. A first polygon having a number of vertices representative of the located points of interest is computed, followed by determining a spatial relation between its vertices and the ROI. The vertices of the first polygon are then pinned to boundaries of and within the ROI such that a second polygon is formed on the ROI. The process is repeated for all vertices of the first polygon such that the second polygon is collapsed onto the ROI. This collapsed second polygon is then used to correct for optical proximity.

Abstract: Methods, and program storage devices, for performing model-based optical lithography corrections by partitioning a cell array layout, having a plurality of polygons thereon, into a plurality of cells covering the layout. This layout is representative of a desired design data hierarchy. A density map is then generated corresponding to interactions between the polygons and plurality of cells, and then the densities within each cell are convolved. An interaction map is formed using the convolved densities, followed by truncating the interaction map to form a map of truncated cells. Substantially identical groupings of the truncated cells are then segregated respectively into differing ones of a plurality of buckets, whereby each of these buckets comprise a single set of identical groupings of truncated cells. A hierarchal arrangement is generated using these buckets, and the desired design data hierarchy enforced using the hierarchal arrangement to ultimately correct for optical lithography.

Abstract: An illumination system having an array optical element with different illumination regions corresponding or matched to different line width variations printed on a photosensitive material. The array optical element may be a filter, diffractive optical element, or micro lens array having illumination regions producing different types of illumination properties or characteristics. Each of the illumination regions are matched or correspond to a respective region on a patterning device to provide optimized exposure of a photosensitive material. The optical element may be used to tailor a conventional illumination system to the unique characteristics of the projection optics used in a system, thereby compensating for vertical and horizontal bias or variations in line width for features oriented in the vertical and horizontal direction.

Abstract: An illumination system used in photolithography for the manufacture of semiconductors having an array optical element with different illumination regions matched to different geometric pattern regions on a reticle. The array optical element may be a filter, diffractive optical element, or microlens array having illumination regions producing different types of illumination properties or characteristics such as quadrupole, annular, or top hat among others. Each of the illumination regions are matched or correspond to a respective pattern region on the reticle to provide optimized exposure of a photosensitive resist covered wafer. The optical element of the present invention may be used to tailor a conventional illumination system to the unique characteristics of a particular reticle. Additionally, imperfections in the optics of a photolithographic system can be compensated for by the optical element.

Abstract: An illumination system for use in photolithography having an array optical element near the formation of a desired illumination field. Light or electromagnetic radiation from an illumination source is expanded and received by a multi-image optical element forming a plurality of secondary illumination sources in a plane. A condenser receives the light from the plurality of illumination sources. A array or diffractive optical element is placed on or near the focal point of the condenser. The illumination plane formed at the focal point of the condenser is within the near field diffraction pattern of the array or diffractive optical element. There is no condenser following the array or diffractive optical element.

Abstract: The invention described herein is an alignment system used in semiconductor manufacturing. It is the core component used to align a mask containing a circuit pattern to a wafer during a scanning sequence. The alignment system images an alignment reticle pattern onto a wafer which contains alignment marks. During scanning, the light from the alignment reticle image is reflected and scattered by the wafer and its alignment marks. Multiple detectors are placed at a pupil plane of the alignment system to collect the reflected and scattered light in the bright-field and dark-field regions. The resulting signals and their analysis results in determination of accurate alignment of a wafer. The alignment system does not use or "look through" the projection optics of the scanning photolithographic device. The broadband spectrum used for alignment illumination cannot be used in the projection optics designed for the deep UV wavelengths without undesirable results.