Abstract: A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

Abstract: A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

Abstract: A fin for a heat sink is provided that includes a plate having a surface and an edge and at least one vane projecting outwardly from the surface and arranged relative to the edge so as to redirect a portion of a stream of air that is impinging upon the edge. A heat transfer system is also provided that includes a heat pipe having an elongate side and a fan that is arranged so as to direct a stream of air toward the elongate side of the heat pipe. At least one plate is arranged in parallel relation to a stream of air created by the fan. The plate includes an opening with the heat pipe positioned within the opening, a surface and an edge and at least one vane projecting outwardly from the surface and arranged relative to the edge so as to redirect a portion of the stream of air that is impinging upon the edge from the fan.