Abstract: A method is provided for the punching of a bridge break and thereafter sealing the bridge break during the injection molding process of the lead frame. The bridge breaking tool is placed over the bridge that is to be broken. The collar presses down on the circuit and the punch presses down on the bridge with enough force to form the bridge break. Once the bridge break is formed the punch is retracted from the cavity of the template and molten polymer is injected to flow around the ends of the bridge break. The bridge breaking tool's hold down collars and retracted punch form a molding area for molten polymer to flow over the bridge break and the exposed circuit area. The bridge breaking tool is retracted after the bridge break is encased in the cured molten polymer and the cured molten polymer forms a lead frame structure.