Abstract: An article of a sheeted cleaning medium (such as a tissue, napkin or wipe) and dispenser is provided for easily dispensing a sheeted cleaning medium and, in an embodiment, as a means of storage for the soiled sheeted cleaning medium. The article comprises a sheeted cleaning medium (such as a tissue, napkin or wipe), a member attached to the sheeted cleaning medium, and a typically hand sized or pocket sized container.

Abstract: An optoelectronic interconnect module comprising a housing having a first aperture on a first side of the housing for receiving an optical ferrule and a second aperture on a second side of the housing for receiving a semiconductor die. A mirror is mounted within the housing at an angle for reflecting optical transmissions between the first and second apertures. A first optical lens is mounted between the first aperture and the mirror, and a second optical lens is mounted between the second aperture and the mirror. The optoelectronic interconnect module transmits an electronically modulated optical signal between an optical fiber in the first aperture and an optoelectronic semiconductor die adjacent to the second aperture within a mutually orthogonal plane.

Abstract: A connector for mounting to and through a wall of a device. In one form of the invention a connector is used for mounting to and through a wall of a device. The connector includes a body, an optical fiber, and a sealant. The body includes a surface having an aperture. The optical fiber has a length and a first end and a second end. A portion of the length of the optical fiber being metallized. The optical fiber passes through the aperture of the surface of the body and the metallized portion of the optical fiber is attached to the aperture of the surface of the body so as to form a hermetic seal between the optical fiber and the aperture of the surface of the body. The sealant is located between the body and the surface of the device so as to provide a hermetic seal between the body and the wall of the device when the body is urged toward the wall of the device thus deforming the sealant. The connector allows an optical signal to be transmitted within the optical fiber through the body.

Abstract: A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has two through-holes formed through a thickness of the non-electrically conductive substrate. The two through-holes are filled with an electrically conductive material so as to form two electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into two regions. The first region has the electrically conductive plating material applied thereto. The first and second through-holes protrudes through the second region.