Abstract: The present invention relates to a blend of at least one amorphous ethylene/propylene-derived copolymer, at least one non-stereoregular propylene-derived polymer having a melt viscosity of greater than about 500 Poise, and an optional tackifier that provide pressure-sensitive adhesive compositions in which a good balance of adequate adhesion to both low and relatively high surface energy substrates can be achieved.

Abstract: An article is disclosed that includes:

Abstract: A pavement marking article that has an adhesive composition for adhering the article to a pavement substrate, where the adhesive composition includes a reaction product of an acrylic acid ester of a monohydric alcohol whose homopolymer has a Tg less than 0° C., a non-polar ethylenically unsaturated monomer, and 0-10 parts by weight of a polar ethylenically unsaturated monomer. Preferably the amount of the acrylic acid ester is about 60-90 parts by weight, and the amount of the non-polar ethylenically unsaturated monomer is about 10-40 parts by weight.

Abstract: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Abstract: The invention relates to a pressure-sensitive adhesive tape with improved room temperature handleability comprising an adhesive layer with at least one exposed surface and optionally a backing, wherein the pressure-sensitive adhesive layer comprises an epoxy/polyester based pressure sensitive adhesive which is crosslinkable upon exposure to actinic or e-beam irradiation and optionally heat, and comprises (i) 30-80% by weight of a polyester component comprising one or more amorphous polyesters compounds, (ii) 20-70% by weight of an epoxy component comprising one or more epoxy resins and/or monomers, (iii) 0-50% by weight of a hydroxyl-functional component containing one or more hydroxyl-containing compounds having a hydroxyl functionality of at least 1, and (iv) an effective amount of a photoinitiator component for crosslinking the pressure-sensitive adhesive, whereby the weight percentages refer to the total mass of components (i)-(iv) and add up to 100 wt.

Abstract: A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Abstract: The invention refers to a method of manufacturing an optical recording medium comprising a first member having a first substrate, a first information storing layer, a first exposed surface and a first inner surface, a second member having a second substrate, a second exposed surface, a second inner surface and optionally a second information storing layer, and an optionally transparent pressure-sensitive adhesive layer interposed between the first inner surface and the second inner surface, said method comprising 1. attaching the pressure-sensitive adhesive layer to the inner surface of one of the members and 2. adhering the inner surface of the other member to the exposed surface of the adhesive layer, wherein the size of any bubbles formed during above steps 1. and/or 2. at the interface between the first and/or second inner surface, respectively, and the pressure-sensitive adhesive layer and/or the disappearance rate of the bubbles are controlled so that the bubbles are removed in less than 30 minutes.

Abstract: Pressure sensitive adhesives and heat activatable adhesives that are the reaction product of an acrylic acid ester of a monohydric alcohol whose homopolymer has a T.sub.g less than 0.degree. C.; a non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a T.sub.g greater than 15.degree. C.; 0-5 parts by weight of a polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a T.sub.g greater than 15.degree. C.; and an electrically conductive agent.

Abstract: Solute polymers in solvent monomers form a coatable syrup that can be cured to a viscoelastomeric material when radiation-sensitive .alpha.-cleaving groups in either the polymer or one of the monomers are exposed to ultraviolet radiation. The solute polymers can be formed from the solvent monomers in situ or be added thereto to form the syrup.

Abstract: A pressure sensitive adhesive that includes:(a) the polymerization product of:(i) 25-98 parts by weight of an acrylic acid ester of a monohydric alcohol whose homopolymer has a T.sub.g less than 0.degree. C.;(ii) 2-75 parts by weight of a non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a T.sub.g greater than 15.degree. C.; and(iii) 0-5 parts by weight of a polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a T.sub.g greater than 15.degree. C.; and(b) at least one tackifier that is miscible in the polymerization product at room temperature.

Abstract: Solute polymers in solvent monomers form a coatable syrup that can be cured to a viscoelastomeric material when radiation-sensitive hydrogen abstracting groups in either the polymer or one of the monomers are exposed to ultraviolet radiation. The solute polymers can be formed from the solvent monomers.

Abstract: A pressure sensitive adhesive that includes:(a) the polymerization product of:(i) 25-98 parts by weight of an acrylic acid ester of a monohydric alcohol whose homopolymer has a T.sub.g less than 0.degree. C.;(ii) 2-75 parts by weight of a non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a T.sub.g greater than 15.degree. C.; and(iii) 0-5 parts by weight of a polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a T.sub.g greater than 15.degree. C.; and(b) at least one tackifier that is miscible in the polymerization product at room temperature.

Abstract: This invention relates to a process in which a composition is coated onto a substrate and crosslinked so as to form a PSA by means of polymerizing free radically polymerizable monomers from covalently attached pendent unsaturation in the polymer component of the composition. The coating can carried out by a wide variety of industrial methods because the process of the invention allows for compositions with a wide degree of possible viscosities.

Abstract: A pressure sensitive adhesive that includes the polymerization product of:(a) 25-97 parts by weight of an acrylic acid ester of a monohydric alcohol whose homopolymer has a T.sub.g less than 0.degree. C.;(b) 3-75 parts by weight of a non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a T.sub.g greater than 15.degree. C.; and(c) 0-5 parts by weight of a polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a T.sub.g greater than 15.degree. C. The relative amounts of the acrylic acid ester, the non-polar ethylenically unsaturated monomer, and the polar ethylenically unsaturated monomer are chosen such that the 90.degree. peel adhesion of the pressure sensitive adhesive to a polypropylene surface is at least 2 lbs/0.5 in. after a 72 hour dwell at room temperature as measured according to Test Procedure B.

Abstract: A pressure sensitive adhesive that includes the polymerization product of:(a) 25-97 parts by weight of an acrylic acid ester of a monohydric alcohol whose homopolymer has a T.sub.g less than 0.degree. C.;(b) 3-75 parts by weight of a non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a T.sub.g greater than 15.degree. C.; and(c) 0-5 parts by weight of a polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a T.sub.g greater than 15.degree. C. The relative amounts of the acrylic acid ester, the non-polar ethylenically unsaturated monomer, and the polar ethylenically unsaturated monomer are chosen such that the 90.degree. peel adhesion of the pressure sensitive adhesive to a surface provided with 1.5.+-.0.25 mg/in.sup.2 oil is greater than zero after a 10 second dwell at room temperature as measured according to Test Procedure B.

Abstract: A pressure sensitive adhesive that includes:(a) the polymerization product of:(i) 25-98 parts by weight of an acrylic acid ester of a monohydric alcohol whose homopolymer has a T.sub.g less than 0.degree. C.;(ii) 2-75 parts by weight of a non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a T.sub.g greater than 15.degree. C.; and(iii) 0-5 parts by weight of a polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a T.sub.g greater than 15.degree. C.; and(b) at least one tackifier that is miscible in the polymerization product at room temperature.

Abstract: Pressure sensitive adhesives and tackified pressure sensitive adhesives that are the polymerization product of an acrylic acid ester of a monohydric alcohol whose homopolymer has a T.sub.g less than 0.degree. C.; a non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a T.sub.g greater than 15.degree. C; and 0-5 parts by weight of a polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a T.sub.g greater than 15.degree. C.

Abstract: Pressure sensitive adhesives and heat activatable adhesives that are the reaction product of an acrylic acid ester of a monohydric alcohol whose homopolymer has a T.sub.g less than 0.degree. C.; a non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a T.sub.g greater than 15.degree. C.; 0-5 parts by weight of a polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a T.sub.g greater than 15.degree. C.; and an electrically conductive agent.

Abstract: A pressure sensitive adhesive that includes the polymerization product of:(a) 25-97 parts by weight of an acrylic acid ester of a monohydric alcohol whose homopolymer has a T.sub.g less than 0.degree. C.;(b) 3-75 parts by weight of a non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a T.sub.g greater than 15.degree. C.; and(c) 0-5 parts by weight of a polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a T.sub.g greater than 15.degree. C. The relative amounts of the acrylic acid ester, the non-polar ethylenically unsaturated monomer, and the polar ethylenically unsaturated monomer are chosen such that the 90.degree. peel adhesion of the pressure sensitive adhesive to a surface provided with 1.5.+-.0.25 mg/in.sup.2 oil is greater than zero after a 10 second dwell at room temperature as measured according to Test Procedure B.

Abstract: A pressure sensitive adhesive that includes the polymerization product of:(a) 25-97 parts by weight of an acrylic acid ester of a monohydric alcohol whose homopolymer has a T.sub.g less than 0.degree. C.;(b) 3-75 parts by weight of a non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater than 10.50 and a T.sub.g greater than 15.degree. C.; and(c) 0-5 parts by weight of a polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of greater than 10.50 and a T.sub.g greater than 15.degree. C. The relative amounts of the acrylic acid ester, the non-polar ethylenically unsaturated monomer, and the polar ethylenically unsaturated monomer are chosen such that the 90.degree. peel adhesion of the pressure sensitive adhesive to a polypropylene surface is at least 2 lbs/0.5 in. after a 72 hour dwell at room temperature as measured according to Test Procedure B.