Abstract: An operating state monitoring device for monitoring a connecting cable, the device may include a connecting cable and at least two Hall sensors. The connecting cable may have at least two electroconductive conductors that extend along a longitudinal central axis, and through each of the conductors current flows or currant can flow by forming a magnetic field. The at least two Hall sensors may be configured to detect magnetic fields and output measuring signals based on detected magnetic fields. The device may have a number of Hall sensors that is identical to the number of conductions. A single Hall sensor may be arranged proximate each conductor via direct contract or indirect contact.

Abstract: An EMI filter for an inverter may include a choke including a magnetic inner core, a magnetic outer core, and at least one conductor pair. The at least one conductor pair may include an electrically conductive positive conductor and an electrically conductive negative conductor. The inner core, the outer core, the positive conductor, and the negative conductor may extend along a longitudinal central axis of the choke. The inner core may be arranged in the outer core. The positive conductor and the negative conductor may be arranged between the inner core and the outer core. The positive conductor and the negative conductor may be arranged spaced apart from one another in a circumferential direction extending around the longitudinal central axis. A gap may be formed between the inner core, the outer core, the positive conductor, and the negative conductor, which are adjacent in the circumferential direction.

Abstract: An inverter for an electric motor may include a capacitor board and at least one electrically conductive contacting unit. The capacitor board may include at least one capacitor and at least one transistor board. The capacitor board and the at least one transistor board may be aligned transversely to a longitudinal direction. The capacitor board and the at least one transistor board may be electrically interconnected. The at least one electrically conductive contacting unit may be configured to contact at least one electrically conductive phase terminal of the motor. The at least one contacting unit may be connected to the at least one transistor board in an electrically conductive manner. The at least one contacting unit may be resilient in the longitudinal direction.

Abstract: An inverter for an electric motor is disclosed. The inverter includes a capacitor board including at least one capacitor, at least one transistor board, and a cooling element. The capacitor board and the at least one transistor board are electrically interconnected. The capacitor board and the at least one transistor board are each aligned transversely to a longitudinal central axis of the inverter. The cooling element is pot-shaped and provides a housing of the inverter that receives the capacitor board and the at least one transistor board.

Abstract: An operating state monitoring device for monitoring a connecting cable, the device may include a connecting cable and at least two Hall sensors. The connecting cable may have at least two electroconductive conductors that extend along a longitudinal central axis, and through each of the conductors current flows or currant can flow by forming a magnetic field. The at least two Hall sensors may be configured to detect magnetic fields and output measuring signals based on detected magnetic fields. The device may have a number of Hall sensors that is identical to the number of conductions. A single Hall sensor may be arranged proximate each conductor via direct contract or indirect contact.

Abstract: An electric power inverter for an electrical machine of an electrically powered drive system may include a capacitor board including a plurality of capacitors and at least one semiconductor board including a plurality of power semiconductors. The capacitor board and the at least one semiconductor board may be electrically interconnected and mutually stacked in a stacking direction, with a clearance, in a stack formation. The plurality of capacitors may be arranged on the capacitor board and fitted to a side thereof facing the at least one semiconductor board. At least one open location space may be defined between the plurality of capacitors and the capacitor board. The at least one open location space may be configured to accommodate the at least one semiconductor board. The at least one semiconductor board may be arranged within the at least one open location space with a clearance to the capacitor board.

Abstract: An electric power inverter may include a capacitor board having a plurality of capacitors, and at least one semiconductor board each having a plurality of power semiconductors. The capacitor board and the at least one semiconductor board may be mutually stacked in a stacking direction, with a clearance, in a stack formation, and may be electrically interconnected. The capacitors may be arranged in the stacking direction, and fitted to a side facing the at least one semiconductor board. The capacitors may be arranged on the capacitor board to form at least one open location space between the capacitors, each positioned to accommodate one semiconductor board. Each semiconductor board may be arranged within the respective location space with a clearance to the capacitor board.

Abstract: An electric power inverter may include a capacitor board having a plurality of capacitors, and at least one semiconductor board having a plurality of power semiconductors. The capacitor board and the at least one semiconductor board may be mutually stacked in a stacking direction, with a clearance, in a stack formation, and may be electrically interconnected. The capacitors may be arranged in the stacking direction, and may be fitted to a side thereof facing the at least one semiconductor board. The capacitors may be arranged on the capacitor board to form at least one open location space between the capacitors, each location space positioned to accommodate a respective one of the at least one semiconductor board. The at least one semiconductor board may be arranged within the respective location space, with a clearance to the capacitor board.

Abstract: An electric power inverter may include a capacitor board having a plurality of capacitors, and at least one semiconductor board each having a plurality of power semiconductors. The capacitor board and the at least one semiconductor board may be mutually stacked in a stacking direction, with a clearance, in a stack formation, and may be electrically interconnected. The capacitors may be arranged in the stacking direction, and fitted to a side facing the at least one semiconductor board. The capacitors may be arranged on the capacitor board to form at least one open location space between the capacitors, each positioned to accommodate one semiconductor board. Each semiconductor board may be arranged within the respective location space with a clearance to the capacitor board.

Abstract: An electric power inverter may include a capacitor board having a plurality of capacitors, and at least one semiconductor board having a plurality of power semiconductors. The capacitor board and the at least one semiconductor board may be mutually stacked in a stacking direction, with a clearance, in a stack formation, and may be electrically interconnected. The capacitors may be arranged in the stacking direction, and may be fitted to a side thereof facing the at least one semiconductor board. The capacitors may be arranged on the capacitor board to form at least one open location space between the capacitors, each location space positioned to accommodate a respective one of the at least one semiconductor board. The at least one semiconductor board may be arranged within the respective location space, with a clearance to the capacitor board.

Abstract: An electric power inverter for an electrical machine of an electrically powered drive system may include a capacitor board including a plurality of capacitors and at least one semiconductor board including a plurality of power semiconductors. The capacitor board and the at least one semiconductor board may be electrically interconnected and mutually stacked in a stacking direction, with a clearance, in a stack formation. The plurality of capacitors may be arranged on the capacitor board and fitted to a side thereof facing the at least one semiconductor board. At least one open location space may be defined between the plurality of capacitors and the capacitor board. The at least one open location space may be configured to accommodate the at least one semiconductor board. The at least one semiconductor board may be arranged within the at least one open location space with a clearance to the capacitor board.