Patents by Inventor Gregor Feiertag

Gregor Feiertag has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10015600
    Abstract: A multi-MEMS module is specified which can be produced expediently and enables a smaller design. The module comprises a housing having an interior and a first and a second opening, a first MEMS chip and a second MEMS chip. The first MEMS chip is acoustically coupled to the first opening. The second MEMS chip is acoustically coupled to the second opening.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: July 3, 2018
    Assignee: TDK Corporation
    Inventors: Wolfgang Pahl, Gregor Feiertag
  • Publication number: 20160345106
    Abstract: A multi-MEMS module is specified which can be produced expediently and enables a smaller design. The module comprises a housing having an interior and a first and a second opening, a first MEMS chip and a second MEMS chip. The first MEMS chip is acoustically coupled to the first opening. The second MEMS chip is acoustically coupled to the second opening.
    Type: Application
    Filed: December 4, 2014
    Publication date: November 24, 2016
    Inventors: Wolfgang Pahl, Gregor Feiertag
  • Patent number: 9061888
    Abstract: Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: June 23, 2015
    Assignee: Epcos AG
    Inventors: Wolfgang Pahl, Gregor Feiertag, Anton Leidl
  • Patent number: 9056760
    Abstract: The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.
    Type: Grant
    Filed: January 24, 2011
    Date of Patent: June 16, 2015
    Assignee: Epcos AG
    Inventors: Gregor Feiertag, Hans Krueger, Wolfgang Pahl, Anton Leidl
  • Patent number: 9051174
    Abstract: Method for producing an MST device, and MST device A method for producing an electromechanical transducer is described, wherein an MST component is arranged in a container, and the container is closed with a cover layer, wherein the cover layer is provided with at least one cutout which divides the cover layer into an inner region and an outer region in such a way that both the inner region and the outer region are connected to the top side—facing the cover layer—of the MST component, and the inner region is lifted off while the outer region remains adhered.
    Type: Grant
    Filed: July 6, 2009
    Date of Patent: June 9, 2015
    Assignee: EPCOS AG
    Inventors: Wolfgang Pahl, Gregor Feiertag
  • Patent number: 8865499
    Abstract: The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S01) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S01) is closed; and a second sound inlet opening (S02) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S01) is prepared but closed.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: October 21, 2014
    Assignee: Epcos AG
    Inventors: Wolfgang Pahl, Hans Krueger, Gregor Feiertag, Alois Stelzl, Anton Leidl, Stefan Seitz
  • Patent number: 8674498
    Abstract: An MEMS package is proposed, wherein a chip having MEMS structures on its top side is connected to a rigid covering plate and a frame structure, which comprises a polymer, to form a sandwich structure in such a way that a closed cavity which receives the MEMS structures is formed. Solderable or bondable electrical contact are arranged on the rear side of the chip or on the outer side of the covering plate which faces away from the chip, and are electrically conductively connected to at least one connection pad by means of an electrical connection structure.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: March 18, 2014
    Assignee: Epcos AG
    Inventors: Gregor Feiertag, Hans Krüger, Alexander Schmajew
  • Patent number: 8674464
    Abstract: A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: March 18, 2014
    Assignee: Epcos AG
    Inventors: Wolfgang Pahl, Gregor Feiertag, Anton Leidl
  • Patent number: 8580613
    Abstract: On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: November 12, 2013
    Assignee: Epcos AG
    Inventors: Gregor Feiertag, Hans Krueger, Anton Leidl, Alois Stelzl
  • Patent number: 8571239
    Abstract: A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the ?3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package.
    Type: Grant
    Filed: October 27, 2011
    Date of Patent: October 29, 2013
    Assignee: Epcos AG
    Inventors: Gregor Feiertag, Anton Leidl, Wolfgang Pahl, Matthias Winter, Christian Siegel
  • Patent number: 8553920
    Abstract: An arrangement includes a circuit carrier and a housed microphone. A mounting side of the housed microphone is mounted on a top side of the circuit carrier. The housed microphone includes solderable contacts on the mounting side and a sound entry opening facing the circuit carrier. An acoustic channel connects the sound entry opening and surroundings above the circuit carrier.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: October 8, 2013
    Assignee: EPCOS AG
    Inventors: Gregor Feiertag, Anton Leidl
  • Publication number: 20130140656
    Abstract: The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (SO1) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (SO1) is closed; and a second sound inlet opening (SO2) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (SO1) is prepared but closed.
    Type: Application
    Filed: July 7, 2011
    Publication date: June 6, 2013
    Applicant: EPCOS AG
    Inventors: Wolfgang Pahl, Hans Krueger, Gregor Feiertag, Alois Stelzl, Anton Leidl, Stefan Seitz
  • Publication number: 20130119492
    Abstract: The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.
    Type: Application
    Filed: January 24, 2011
    Publication date: May 16, 2013
    Applicant: EPCOS AG
    Inventors: Gregor Feiertag, Hans Krueger, Wolfgang Pahl, Anton Leidl
  • Patent number: 8404516
    Abstract: A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: March 26, 2013
    Assignee: EPCOS AG
    Inventors: Christian Bauer, Gregor Feiertag, Hans Krueger, Alois Stelzl
  • Patent number: 8294535
    Abstract: A component includes a first substrate having a first front side for holding first component structures, and a second substrate having a second front side for holding second component structures. The first and second substrates are connected together electrically and mechanically. The first and second front sides face each other. The first and second component structures include SAW structures, FBAR structures, MEMS sensors or switches, or MEOPS components, or combinations thereof.
    Type: Grant
    Filed: May 24, 2006
    Date of Patent: October 23, 2012
    Assignee: EPCOS AG
    Inventors: Gregor Feiertag, Hans Krüger, Wolfgang Pahl, Alois Stelzl
  • Publication number: 20120093346
    Abstract: A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the ?3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package.
    Type: Application
    Filed: October 27, 2011
    Publication date: April 19, 2012
    Applicant: EPCOS AG
    Inventors: Gregor Feiertag, Anton Leidl, Wolfgang Pahl, Matthias Winter, Christian Siegel
  • Publication number: 20110298064
    Abstract: Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout.
    Type: Application
    Filed: July 26, 2011
    Publication date: December 8, 2011
    Applicant: EPCOS AG
    Inventors: Wolfgang Pahl, Gregor Feiertag, Anton Leidl
  • Publication number: 20110233690
    Abstract: On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.
    Type: Application
    Filed: June 16, 2009
    Publication date: September 29, 2011
    Applicant: Epcos AG
    Inventors: Gregor Feiertag, Hans Krueger, Anton Leidl, Alois Stelzl
  • Publication number: 20110180885
    Abstract: Method for producing an MST device, and MST device A method for producing an electromechanical transducer is described, wherein an MST component is arranged in a container, and the container is closed with a cover layer, wherein the cover layer is provided with at least one cutout which divides the cover layer into an inner region and an outer region in such a way that both the inner region and the outer region are connected to the top side—facing the cover layer—of the MST component, and the inner region is lifted off while the outer region remains adhered.
    Type: Application
    Filed: July 6, 2009
    Publication date: July 28, 2011
    Applicant: EPCOS AG
    Inventors: Wolfgang Pahl, Gregor Feiertag
  • Publication number: 20110018076
    Abstract: A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side.
    Type: Application
    Filed: July 23, 2010
    Publication date: January 27, 2011
    Inventors: Wolfgang Pahl, Gregor Feiertag, Anton Leidl