Abstract: Use of a hotmelt adhesive is disclosed for fixing at least one micro device on a carrier. A pasty fixation compound is further disclosed for micro devices including a powdered hotmelt adhesive, an anti-flow additive and a solvent for the anti-flow additive. Furthermore, a method is disclosed for fixing at least one micro device on a carrier, a hotmelt adhesive being applied to a carrier, the micro device being positioned at a predetermined distance from the carrier and fixed by the hotmelt adhesive until a solid adhesive bond has been produced between the at least one micro device and the carrier by cooling the hotmelt adhesive, the gap produced being filled by an epoxy resin and the two devices being adhesively bonded securely by curing of the epoxy resin. Furthermore, a detector is disclosed for detecting ionizing radiation which has a multiplicity of detector elements disposed in a two-dimensional arrangement.