Patents by Inventor Gregor Langer

Gregor Langer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210265168
    Abstract: A process for producing an electrical contact with a first metal layer and at least one second metal layer on a silicon carbide substrate includes removing at least some of the carbon residue by a cleaning process, to clean the first metal layer. The first metal layer and/or the at least one second metal layer may be generated by sputtering deposition.
    Type: Application
    Filed: May 10, 2021
    Publication date: August 26, 2021
    Inventors: Stefan Krivec, Ronny Kern, Stefan Kramp, Gregor Langer, Hannes Winkler, Stefan Woehlert
  • Publication number: 20210225795
    Abstract: A SiC power semiconductor device includes: a power semiconductor die including SiC and a metallization layer, wherein the metallization layer includes a first metal; a die carrier, wherein the power semiconductor die is arranged over the die carrier such that the metallization layer faces the die carrier, the die carrier being at least partially covered by a plating that includes Ni; and a first intermetallic compound arranged between the power semiconductor die and the plating and including Ni3Sn4.
    Type: Application
    Filed: January 15, 2021
    Publication date: July 22, 2021
    Inventors: Ralf Otremba, Gregor Langer, Paul Frank, Alexander Heinrich, Alexandra Ludsteck-Pechloff, Daniel Pedone
  • Patent number: 11043383
    Abstract: A process for producing an electrical contact with a first metal layer and at least one second metal layer on a silicon carbide substrate includes removing at least some of the carbon residue by a chemical cleaning process, to clean the first metal layer. The first metal layer and/or the at least one second metal layer may be generated by sputtering deposition.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: June 22, 2021
    Assignee: Infineon Technologies AG
    Inventors: Stefan Krivec, Ronny Kern, Stefan Kramp, Gregor Langer, Hannes Winkler, Stefan Woehlert
  • Publication number: 20200323081
    Abstract: A method for embedding a component in a printed circuit board or a printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate product comprises at least one insulating layer made of a prepreg material, and the component is fixed by the resin of the prepreg material, is characterized by the following steps: providing a combination of the layers of the printed circuit board, or of the printed circuit board intermediate product, wherein this combination includes at least one curable prepreg material; creating a clearance in the combination for accommodating the component to be embedded; covering at least the region of the clearance with a first temporary carrier layer on a first side of the combination; positioning the component to be embedded in the clearance by way of the first temporary carrier layer; covering at least the region of the clearance on the second side of the combination with a second temporary carrier layer; compressing the combinatio
    Type: Application
    Filed: June 22, 2020
    Publication date: October 8, 2020
    Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Timo Schwarz, Andreas Zluc, Gregor Langer, Johannes Stahr
  • Patent number: 10779413
    Abstract: A method for embedding a component in a printed circuit board or a printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate product comprises at least one insulating layer made of a prepreg material, and the component is fixed by the resin of the prepreg material, is characterized by the following steps: providing a combination of the layers of the printed circuit board, or of the printed circuit board intermediate product, wherein this combination includes at least one curable prepreg material; creating a clearance in the combination for accommodating the component to be embedded; covering at least the region of the clearance with a first temporary carrier layer on a first side of the combination; positioning the component to be embedded in the clearance by way of the first temporary carrier layer; covering at least the region of the clearance on the second side of the combination with a second temporary carrier layer; compressing the combinatio
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: September 15, 2020
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Timo Schwarz, Andreas Zluc, Gregor Langer, Johannes Stahr
  • Publication number: 20190362973
    Abstract: A process for producing an electrical contact with a first metal layer and at least one second metal layer on a silicon carbide substrate includes removing at least some of the carbon residue by a chemical cleaning process, to clean the first metal layer. The first metal layer and/or the at least one second metal layer may be generated by sputtering deposition.
    Type: Application
    Filed: May 24, 2019
    Publication date: November 28, 2019
    Inventors: Stefan Krivec, Ronny Kern, Stefan Kramp, Gregor Langer, Hannes Winkler, Stefan Woehlert
  • Publication number: 20190221718
    Abstract: An electronic module and method for the production of the electronic module in accordance with some embodiments of the invention are disclosed. The electronic module includes at least one electronic component affixed to a conductive layer by means of sticky electrically insulating layer, where the electronic component is embedded in a transparent foil. The electronic module is produces by providing an electrically conductive layer. At least one electronic component is affixed to the electrically conductive layer by means of a sticky electrically insulating layer and embedded in a transparent foil. The at least one electronic component is electronically contacted with the conductive layer.
    Type: Application
    Filed: March 27, 2019
    Publication date: July 18, 2019
    Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Gregor Langer, Johannes Stahr
  • Patent number: 10283680
    Abstract: An electronic module and method for the production of the electronic module in accordance with some embodiments of the invention are disclosed. The electronic module includes at least one electronic component affixed to a conductive layer by means of sticky electrically insulating layer, where the electronic component is embedded in a transparent foil. The electronic module is produces by providing an electrically conductive layer. At least one electronic component is affixed to the electrically conductive layer by means of a sticky electrically insulating layer and embedded in a transparent foil. The at least one electronic component is electronically contacted with the conductive layer.
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: May 7, 2019
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Gregor Langer, Johannes Stahr
  • Patent number: 9903539
    Abstract: The invention relates to a circuit board element (1) comprising a substrate (2), on which at least one dielectric layer (7) is arranged, and at least one LED (light-emitting diode) (10), wherein at least one channel-shaped waveguide cavity (11) leading away from the LED (10) is provided in the dielectric layer (7), which waveguide cavity leads to at least one integrated light-sensitive component (12), preferably a photo-diode or photocell, arranged for examining the light emission, wherein the LED (10) is preferably also arranged in a cavity (9) that is connected to the waveguide cavity (11). The invention further relates to a method for producing such a circuit board element (1).
    Type: Grant
    Filed: March 20, 2012
    Date of Patent: February 27, 2018
    Assignee: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
    Inventors: Alexander Kasper, Gregor Langer
  • Patent number: 9713248
    Abstract: Method for the manufacture of a printed circuit board with at least one cavity for the accommodation of an electronic component, wherein the cavity walls exhibit a reflective, in particular mirrored reflector layer characterized by the following steps: Provision of a printed circuit board, Application of a temporary protective layer onto at least a section of the surface of the circuit board, Creation of the cavity by way of penetration of the protective layer in the region of the cavity, Application of the reflector layer, Removal of the temporary protective layer.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: July 18, 2017
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Gregor Langer, Mario Damej, Ferdinand Lutschounig
  • Publication number: 20160353566
    Abstract: Method for the manufacture of a printed circuit board with at least one cavity for the accommodation of an electronic component, wherein the cavity walls exhibit a reflective, in particular mirrored reflector layer characterized by the following steps: Provision of a printed circuit board, Application of a temporary protective layer onto at least a section of the surface of the circuit board, Creation of the cavity by way of penetration of the protective layer in the region of the cavity, Application of the reflector layer, Removal of the temporary protective layer.
    Type: Application
    Filed: January 21, 2015
    Publication date: December 1, 2016
    Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Gregor LANGER, Mario DAMEJ, Ferdinand LUTSCHOUNIG
  • Publication number: 20160329469
    Abstract: An electronic module and method for the production of the electronic module in accordance with some embodiments of the invention are disclosed. The electronic module includes at least one electronic component affixed to a conductive layer by means of sticky electrically insulating layer, where the electronic component is embedded in a transparent foil. The electronic module is produces by providing an electrically conductive layer. At least one electronic component is affixed to the electrically conductive layer by means of a sticky electrically insulating layer and embedded in a transparent foil. The at least one electronic component is electronically contacted with the conductive layer.
    Type: Application
    Filed: May 5, 2016
    Publication date: November 10, 2016
    Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Gregor Langer, Johannes Stahr
  • Publication number: 20160324004
    Abstract: A method for embedding a component in a printed circuit board or a printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate product comprises at least one insulating layer made of a prepreg material, and the component is fixed by the resin of the prepreg material, is characterized by the following steps: providing a combination of the layers of the printed circuit board, or of the printed circuit board intermediate product, wherein this combination includes at least one curable prepreg material; creating a clearance in the combination for accommodating the component to be embedded; covering at least the region of the clearance with a first temporary carrier layer on a first side of the combination; positioning the component to be embedded in the clearance by way of the first temporary carrier layer; covering at least the region of the clearance on the second side of the combination with a second temporary carrier layer; compressing the combinat
    Type: Application
    Filed: December 12, 2014
    Publication date: November 3, 2016
    Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Timo Schwarz, Andreas Zluc, Gregor Langer, Johannes Stahr
  • Patent number: 9182549
    Abstract: An optical coupling system for coupling a first optical waveguide having a first core surrounded by a first sheath to a second optical waveguide having a second core surrounded by a second sheath. An end face of the first core of the first optical waveguide abuts an end face of the second core of the second optical waveguide at a coupling location and the second core is flush with the first core in the axial direction, wherein, in the region of the coupling location, over at least part of a predetermined axial portion, both the second sheath of the second optical waveguide and the first sheath of the first optical waveguide together form a cladding of the optical waveguide in the predetermined portion.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: November 10, 2015
    Assignees: Rosenberger-OSI GmbH & CO. OHG, AT&S AG
    Inventors: Clemens Wurster, Gregor Langer, Stefan Schmidt, Hannes Stahr
  • Publication number: 20150115303
    Abstract: The present invention relates to an LED module 10, a circuit board 1, and a method for coating the circuit board 1 that is used in an LED module 10. The circuit board 1 is used particularly for reflecting light emitted by at least one LED chip of the LED module 10. The at least one LED chip 6 is located on a carrier plate 5 in a cut-out 2 of the circuit board 1. To increase the light yield of the LED module 10, the circuit board 1 is sprayed with a highly reflective layer 4. The layer 4 can be an ink provided with reflective particles, for example, which is sprayed on using an ink jet printing method. The LED module can additionally have at least one colour conversion element 7, 8, 9, which is preferably positioned in or above the at least one cut-out 2 of the circuit board 1. Finally; positioning elements 12, 13 can improve the assembly of the LED module 10, particularly the alignment of the circuit board 1 and the carrier plate 5.
    Type: Application
    Filed: March 7, 2013
    Publication date: April 30, 2015
    Applicants: Tridonic Jennersdorf GmbH, AT&S Austria Techmologie & Systemtechnik Aktiengesellchaft
    Inventors: Peter Pachler, Anna Szucs, Gregor Langer, Christian Sommer
  • Publication number: 20140373350
    Abstract: The invention relates to a method for producing a circuit board involving the removal of a subregion thereof. In said method, at least two layers or plies of the circuit board (1) are interconnected, the subregion (6) to be removed is prevented from being connected to an adjacent ply of the circuit board by providing a layer (7) of adhesion-preventing or bonding-preventing material, and peripheral zones (8) of the subregion (6) to be removed are separated from adjoining zones of the circuit board (1). According to the invention, a fissure formation and/or a detachment from the subregion (6) of the circuit board (1) to be removed is initiated in a subregion in or on the layer (7) of adhesion-preventing or bonding-preventing material, and the subregion (6) to be removed is then removed, thus making it possible to remove a subregion (6) to be removed from a circuit board (1) in a simple and reliable, and if necessary automated, manner.
    Type: Application
    Filed: December 3, 2012
    Publication date: December 25, 2014
    Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Markus Leitgeb, Gerald Weidinger, Gregor Langer, Volodymyr Karpovych
  • Publication number: 20140233241
    Abstract: The invention relates to a circuit board element (1) comprising a substrate (2), on which at least one dielectric layer (7) is arranged, and at least one LED (light-emitting diode) (10), wherein at least one channel-shaped waveguide cavity (11) leading away from the LED (10) is provided in the dielectric layer (7), which waveguide cavity leads to at least one integrated light-sensitive component (12), preferably a photo-diode or photocell, arranged for examining the light emission, wherein the LED (10) is preferably also arranged in a cavity (9) that is connected to the waveguide cavity (11). The invention further relates to a method for producing such a circuit board element (1).
    Type: Application
    Filed: March 20, 2012
    Publication date: August 21, 2014
    Applicant: AT & S AUSTRIA TECHNOLOGIES & SYSTEMTECHNIK AKTIENGESELLSCHAFT
    Inventors: Alexander Kasper, Gregor Langer
  • Patent number: 8705905
    Abstract: The invention relates to a printed circuit board element (10), comprising at least one flexible printed circuit board part (12) and at least one rigid printed circuit board part (11A, 11C; 34, 35; 37) having a component (17), which is accommodated in a cavity (14) and with a light-emitting or light-receiving part (17) projects over the edge (18) of the cavity (14), wherein the flexible printed circuit board part (12) has a flexible layer (15?) made of an optical, photo-polymerizable material (15), in which an optical fiber (15) is structured in alignment with the light-emitting or light-receiving part (17) of the optoelectronic component (17) by way of radiation.
    Type: Grant
    Filed: September 11, 2008
    Date of Patent: April 22, 2014
    Assignee: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Gregor Langer, Johannes Stahr
  • Publication number: 20140050442
    Abstract: An optical coupling system for coupling a first optical waveguide having a first core surrounded by a first sheath to a second optical waveguide having a second core surrounded by a second sheath. An end face of the first core of the first optical waveguide abuts an end face of the second core of the second optical waveguide at a coupling location and the second core is flush with the first core in the axial direction, wherein, in the region of the coupling location, over at least part of a predetermined axial portion, both the second sheath of the second optical waveguide and the first sheath of the first optical waveguide together form a cladding of the optical waveguide in the predetermined portion.
    Type: Application
    Filed: April 4, 2012
    Publication date: February 20, 2014
    Applicants: AT&S AG, ROSENBERGER-OSI GMBH & CO. OHG
    Inventors: Clemens Wurster, Gregor Langer, Stefan Schmidt, Hannes Stahr
  • Publication number: 20130202488
    Abstract: The invention relates to an optical sensor device (1) comprising a substrate (2) on which at least one light source (4), such as an LED, is arranged, from which at least one optical waveguide (7) leads to at least one receiver (5), such as a photodiode, to which an evaluating unit (6) is connected, wherein the optical waveguide (7) is accessible in a sensor region (8) for a change of the evanescent field of the optical waveguide present there; an optical layer (3) made of material that can be photopolymerized is applied to the substrate (2), wherein the optical waveguide (7) is structured by an exposure process in said optical layer, wherein the optical waveguide (7) is led to the surface (9) of the optical layer (3) in the sensor region (8).
    Type: Application
    Filed: October 14, 2011
    Publication date: August 8, 2013
    Inventors: Gregor Langer, Hannes Voraberger