Abstract: A new class of dielectric polymer material, which is particularly suitable for the manufacturing of electronic devices, is formed by reacting bismaleimide compounds and shows an advantageous well-balanced profile of favorable material properties. The bismaleimide compounds have an oligomeric structure with an heteroaromatic extended repeating unit in the middle part of the molecule and maleimide groups at each terminal end of the molecule. There is further provided a method for forming said dielectric polymer material. Beyond that, the present invention relates to the dielectric polymer material and to an electronic device including the same.

Abstract: Synthesis of guanidinium-based polymers is disclosed. Chemical Mechanical Planarization (CMP) slurries comprise abrasives; activator; oxidizing agent; additive comprising guanidinium-based polymers; and water. The use of the synthesized guanidinium-based polymers in the CMP slurries reduces dishing and erosion in highly selective tungsten slurries.

Abstract: Compounds of structure (I) are described wherein, R1, R2, R1a and R2a are independently selected from H, nitro, cyano, and an alkylsulfonyl, wherein at least two of R1, R2, R1a and R2a are independently selected from nitro, cyano, and an alkylsulfonyl, and X? is not a halide, tosylate, trifluoromethylsulfonate, tetrafluoroborate, an aryl-substituted borates, hexafluorophosphate, hexafluoroarsenate, acetate, trifluoroacetate, methane sulfonate, C-2 to C-20 linear unsubstituted alkyl sulfonates, naphthalenesulfonate, and camphorsulfonate. Also described are EUV negative and positive chemically amplified photoresist compostions containing said compound and the process of using these photoresist to pattern a substrate.

Abstract: Synthesis of polycationic polymer or copolymer is disclosed. The polycationic polymer or copolymer are formed by at least one first cationic monomer and at least one second cationic monomer wherein the first cationic monomer and the second cationic monomer have different cationic groups; such as imidazolium group and non-imidazolium group. Chemical Mechanical Planarization (CMP) slurries comprise abrasives; activator; oxidizing agent; additive comprising polycationic polymer or copolymer; and water are also disclosed. The use of the synthesized polycationic polymer or copolymer in the CMP slurries reduces dishing and erosion in highly selective tungsten slurries.

Abstract: Synthesis of triazole- and/or triazolium-based polymers is disclosed. Chemical Mechanical Planarization (CMP) slurries comprise abrasives; activator; oxidizing agent; additive comprising triazole- and/or triazolium-based polymers; and water. The use of the synthesized triazole- and/or triazolium-based polymers in the CMP slurries reduces dishing and erosion in highly selective tungsten slurries.

Abstract: Synthesis of phosphonium based polymers is disclosed. Chemical Mechanical Planarization (CMP) slurries comprise abrasives; activator; oxidizing agent; additive comprising phosphonium based polymers; and water. The use of the synthesized phosphonium based polymers in the CMP slurries reduces dishing and erosion in highly selective tungsten slurries.

Abstract: The present invention relates to a new class of dielectric polymer material, which is particularly suitable for the manufacturing of electronic devices. The dielectric polymer material is formed by reacting bismaleimide compounds and shows an advantageous well-balanced profile of favorable material properties. The bismaleimide compounds have an oligomeric structure with an oligoamide extended repeating unit in the middle part of the molecule and maleimide groups at each terminal end of the molecule. There is further provided a method for forming said dielectric polymer material. Beyond that, the present invention relates to the dielectric polymer material and to an electronic device comprising the same.

Abstract: Synthesis of imidazolium-based poly(ionic liquid)s is disclosed. Chemical Mechanical Planarization (CMP) slurries comprise abrasives; activator; oxidizing agent; additive comprising imidazolium-based poly(ionic liquid); and water. The use of the synthesized imidazolium-based poly(ionic liquid)s in the CMP slurries reduces dishing and erosion in highly selective tungsten slurries.

Abstract: A polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties, and excellent mechanical properties. The polymerizable mixture can be used in a method for forming copolymers and the copolymers can be used in an electronic device as dielectric material. The copolymers can also be used in a manufacturing method for preparing a packaged microelectronic structure and microelectronic devices comprising the packaged microelectronic structure.

Abstract: The present invention relates to a new class of dielectric polymer material, which is particularly suitable for the manufacturing of electronic devices. The dielectric polymer material is formed by reacting bismaleimide compounds and shows an advantageous well-balanced profile of favorable material properties. The bismaleimide compounds have an oligomeric structure with an amide-imide extended repeating unit in the middle part of the molecule and maleimide groups at each terminal end of the molecule. There is further provided a method for forming said dielectric polymer material. Beyond that, the present invention relates to the dielectric polymer material and to an electronic device comprising the same.

Abstract: The present invention relates to a novel class of polymers which can be used as dielectric material for the preparation of passivation layers in electronic devices. The polymers are prepared from polymerizable compounds having mesogenic groups and they provide excellent film forming capability and excellent mechanical properties and have a low dielectric constant and a low coefficient of thermal expansion (CTE). There is further provided a method for forming said polymers and an electronic device containing said polymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Abstract: The present invention relates to a new class of dielectric polymer material, which is particularly suitable for the manufacturing of electronic devices. The dielectric polymer material is formed by reacting bismaleimide compounds and shows an advantageous well-balanced profile of favorable material properties. The bismaleimide compounds have an oligomeric structure with a cardo and/or spiro moiety containing repeating unit in the middle part of the molecule and maleimide groups at each terminal end of the molecule. There is further provided a method for forming said dielectric polymer material and an electronic device comprising the same as dielectric material.

Abstract: The present invention relates to a polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices. The polymerizable mixture comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties and excellent mechanical properties. There is further provided a method for forming said copolymers and an electronic device containing said copolymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Abstract: The present invention relates to a polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices. The polymerizable mixture comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties and excellent mechanical properties. There is further provided a method for forming said copolymers and an electronic device containing said copolymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Abstract: The present invention relates to a polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices. The polymerizable mixture comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties and excellent mechanical properties. There is further provided a method for forming said copolymers and an electronic device containing said copolymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Abstract: The present invention relates to a novel class of polymers which can be used as dielectric material for the preparation of passivation layers in electronic devices. The polymers are prepared from polymerizable compounds having mesogenic groups and they provide excellent film forming capability and excellent mechanical properties and have a low dielectric constant and a low coefficient of thermal expansion (CTE). There is further provided a method for forming said polymers and an electronic device containing said polymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Abstract: The present invention relates to a conjugate containing at least one kidney-selective carrier molecule and at least one active compound which has a protective action for the kidney against nephrotoxic active compounds, to a process for the preparation of the conjugate, to the use thereof for the protection of the kidney against nephrotoxic active compounds, and to a medicament comprising the conjugate.

Abstract: The invention relates to ultrasmall, monodisperse nanoparticles comprising silicon dioxide to the surface of which at least one antigen is attached. The nanoparticles can be used for the immunoprophylaxis or immunotherapy of cancer. The invention also relates to a method for the targeting of antigens at antigen-presenting cells and for the activation of the immune system, where the efficiency of targeting and/or immunoactivation are set via the particle characteristics. The invention also relates to a method for the active and passive immunisation of a mammal.

Abstract: The present invention relates to a peptide which consists of more than 50% of sequence sections of the formula -(An-Bm-Co)-, and to a conjugate containing the peptide and at least one covalently bonded active compound, and to a process for the preparation of the conjugate. The present invention furthermore relates to the use of the peptide and the conjugate for targeting of the kidney, and to a medicament comprising the peptide or conjugate.

Abstract: The invention relates to ultrasmall, monodisperse nanoparticles comprising silicon dioxide to the surface of which at least one antigen is attached. The nanoparticles can be used for the immunoprophylaxis or immunotherapy of cancer. The invention also relates to a method for the targeting of antigens at antigen-presenting cells and for the activation of the immune system, where the efficiency of targeting and/or immunoactivation are set via the particle characteristics. The invention also relates to a method for the active and passive immunisation of a mammal.