Abstract: Assembly of semiconductor chips is accomplished using an acrylate-based adhesive which can be cured rapidly by UV light and which gives an adhesive bond that is resistant to soldering by can be readily removed by solvents after soldering. During assembly, the back sides of the semiconductor chips are bonded to a temporary carrier by the adhesive and adjusted to the proper mirror image position on the carrier before the adhesive is cured. The chip array is then soldered on a component and the temporary carrier is removed from the chips by a solvent.

Abstract: An assembly process for strip-shaped LED chips (112) in a row on a solid metal carrier (M) is to be specified. The observation of strictest tolerances in all three directions, i.e. in view of division spacing, trueness to line and surface planarity, is thereby required. On the other hand, an optimum thermal coupling to the metal carrier (M) is required for the illumination of the high dissipated heat from the LEDs (113) of a LED chip (112). The LED chips (112) are applied on to the metal carrier (M) in a transfer process. To that end, the LEDs have their faces glued onto an auxiliary carrier (H1) positioned with high precision and the LED row (114) prefabricated in this fashion is then soldered onto the previously solder-coated metal carrier (M). The auxiliary carrier (H1) is subsequently removed.

Abstract: A method for laser soldering of soldered connections of flexible wiring, which are provided at their contact points with a flux. The parts to be joined are held together by a clamp made of translucent material. The transmission of heat for the soldering process is provided by a non-contact laser beam. When the laser beam is applied the solder on both strip conductors melts. Upon removing the heat source the connection hardens to a solid solder joint.