Patents by Inventor Gregorio G. Dela Cruz

Gregorio G. Dela Cruz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7598598
    Abstract: A semiconductor package comprising a leadframe. The leadframe itself comprises an outer frame portion which defines a central opening. Disposed within the central opening is a die pad which defines opposed, generally planar top and bottom die pad surfaces and a peripheral edge. Connected to and extending between the outer frame portion and the peripheral edge of the die pad is at least one tie bar of the leadframe. The leadframe also includes a plurality of leads which are connected to the outer frame portion and extend into the opening at least partially about the die pad in spaced relation to the peripheral edge thereof. Each of the leads includes opposed, generally planar top and bottom lead surfaces, with at least two of the leads comprising corner leads which extend along opposed sides of the tie bar. Each of the corner leads further defines an angularly offset distal portion which extends along and in spaced relation to the tie bar.
    Type: Grant
    Filed: August 3, 2004
    Date of Patent: October 6, 2009
    Assignee: Amkor Technology, Inc.
    Inventors: Ludovico Bancod, Gregorio G. Dela Cruz, Fidelyn R. Canoy, Leocadio M. Alabin
  • Patent number: 6885086
    Abstract: A lead frame strip for use in the manufacture of integrated circuit chip packages. The strip comprises at least one array defining a multiplicity of lead frames. The lead frames each include an outer frame defining a central opening having a die pad disposed therein. Attached to the outer frame and extending toward the die pad in spaced relation to each other are a plurality of leads. The outer frames are integrally connected to each other such that the lead frames are arranged in a matrix wherein the leads thereof extend in multiple rows and columns. The leads of the lead frames within each of the rows and columns are arranged in sets which are disposed in spaced relation to each other. A plurality of openings are formed within the strip between and in alignment with the leads of each of the lead frames within each of the rows and columns.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: April 26, 2005
    Assignee: Amkor Technology, Inc.
    Inventors: Harry J. Fogelson, Ludovico E. Bancod, Gregorio G. dela Cruz, Primitivo A. Palasi, William M. Anderson, Ahmer Syed
  • Patent number: 6847099
    Abstract: A semiconductor package comprising a leadframe. The leadframe itself comprises an outer frame portion which defines a central opening. Disposed within the central opening is a die pad which defines opposed, generally planar top and bottom die pad surfaces and a peripheral edge. Connected to and extending between the outer frame portion and the peripheral edge of the die pad is at least one tie bar of the leadframe. The leadframe also includes a plurality of leads which are connected to the outer frame portion and extend into the opening at least partially about the die pad in spaced relation to the peripheral edge thereof. Each of the leads includes opposed, generally planar top and bottom lead surfaces, with at least two of the leads comprising corner leads which extend along opposed sides of the tie bar. Each of the corner leads further defines an angularly offset distal portion which extends along and in spaced relation to the tie bar.
    Type: Grant
    Filed: February 5, 2003
    Date of Patent: January 25, 2005
    Assignee: Amkor Technology Inc.
    Inventors: Ludovico Bancod, Gregorio G. Dela Cruz, Fidelyn R. Canoy, Leocadio M. Alabin