Abstract: [OBJECT] A composition of a metal nanoparticle is provided in which reproducibility in a method of producing a metal film with excellent low-temperature sinterable properties is improved. An article using the metal nanoparticle composition is also provided. [SOLVING MEANS] A composition of a metal nanoparticle that has a secondary aggregation diameter (median diameter) of 2.0 ?m or less as determined by disk centrifugal-type particle size measurement is used.

Abstract: A silver nanoparticle composition is provided which is possible to be sintered through sintering at a low temperature in a short time and to form silver electro conductive film and wiring which is favorable for adhesion to a substrate and low in resistance, and articles using the same are provided. The silver nanoparticle composition is provided, wherein a main component of a solvent is water, a pH of the composition is within a range of 5.3 to 8.0, a silver nanoparticle included in the composition is protected by an organic acid or a derivative thereof, and the content of the organic acid or the derivative thereof with respect to silver is 2 to 20% by mass.

Abstract: An analytical substrate for amplifying Raman signals by a factor greater than 10,000, or by a factor less than 1,000,000. The analytical substrate is fabricated by depositing a film on the substrate and heating the substrate to a temperature less than 100 degrees Celsius for a period of time less than 30 seconds. The film can comprise a metallic nanoparticle dispersion that can further comprise a population of metallic nanoparticles. In some instances, the metallic nanoparticles have an average cross-sectional dimension in a range of about 1 nm to about 100 nm. In other instances each nanoparticle comprises at least one ligand bound to a surface of the nanoparticle, where the ligand comprises a heteroatom head group bound to the nanoparticle surface and a tail bound to the heteroatom head group.

Abstract: A silver nanoparticle composition is provided which is possible to be sintered through sintering at a low temperature in a short time and to form silver electro conductive film and wiring which is favorable for adhesion to a substrate and low in resistance, and articles using the same are provided. The silver nanoparticle composition is provided, wherein a main component of a solvent is water, a pH of the composition is within a range of 5.3 to 8.0, a silver nanoparticle included in the composition is protected by an organic acid or a derivative thereof, and the content of the organic acid or the derivative thereof with respect to silver is 2 to 20% by mass.

Abstract: [Object] A composition of a metal nanoparticle is provided in which reproducibility in a method of producing a metal film with excellent low-temperature sinterable properties is improved. An article using the metal nanoparticle composition is also provided. [Solving Means] A composition of a metal nanoparticle that has a secondary aggregation diameter (median diameter) of 2.0 ?m or less as determined by disk centrifugal-type particle size measurement is used.

Abstract: A process is described for the synthesis of metallic nanoparticles by chemical reduction of metal salts in the presence of organic ligands capable of binding to the metal particle surfaces and stabilizing them against agglomeration. The resultant nanoparticles or dispersions of the particles can be sintered into highly conductive films or traces at temperatures as low as 80° C. in 10 minutes or less.

Abstract: An analytical substrate for amplifying Raman signals by a factor greater than 10,000, or by a factor less than 1,000,000. The analytical substrate is fabricated by depositing a film on the substrate and heating the substrate to a temperature less than 100 degrees Celsius for a period of time less than 30 seconds. The film can comprise a metallic nanoparticle dispersion that can further comprise a population of metallic nanoparticles. In some instances, the metallic nanoparticles have an average cross-sectional dimension in a range of about 1 nm to about 100 nm. In other instances each nanoparticle comprises at least one ligand bound to a surface of the nanoparticle, where the ligand comprises a heteroatom head group bound to the nanoparticle surface and a tail bound to the heteroatom head group.

Abstract: Disclosed are cohesive metallic structures, comprising sintered metallic nanoparticles, suitable for shielding against electromagnetic interference and radio frequency interference. Also disclosed are methods for forming such structures. Devices for shielding electromagnetic radiation and methods of shielding electromagnetic radiation using such devices are also provided.

Abstract: A metallic nanoparticle shielding structure derived from a substrate having metallic nanoparticles deposited thereon in either a pattern or a coating. The pattern can comprise one or more marks that have a width of 20 to 40 micrometers and that can overlap one another. The metallic nanoparticles can be heated at a temperature less than 110 degrees Celsius for a period of time less than 90 seconds. In some embodiments, the metallic nanoparticle shielding structure can be applied to liquid crystal displays, polyester substrates, polycarbonate substrates, or any other suitable substrate.

Abstract: Disclosed are cohesive metallic structures, comprising sintered metallic nanoparticles, suitable for shielding against electromagnetic interference and radio frequency interference. Also disclosed are methods for forming such structures. Devices for shielding electromagnetic radiation and methods of shielding electromagnetic radiation using such devices are also provided.

Abstract: Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.

Abstract: Disclosed are compositions comprising metallic nanoparticles suitable for use in cohesive, highly conductive structures on substrates. Also disclosed are methods for synthesizing the compositions and methods for forming cohesive, highly conductive structures from the compositions.

Abstract: Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.

Abstract: A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (ROM). These compositions can be applied by any convenient printing process to produce patterns of electrical conductors on temperature-sensitive electronic substrates. The pattern can be thermally cured in seconds to form pure metal conductors at a temperature low enough to avoid damaging the substrate.

Abstract: A method for managing IO requests from a virtual machine to access IO resources on a physical machine includes determining a request priority associated with an IO request. The IO request is placed in an appropriate queue in response to determining the request priority.

Abstract: A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (ROM). These compositions can be applied by any convenient printing process to produce patterns of electrical conductors on temperature-sensitive electronic substrates. The pattern can be thermally cured in seconds to form pure metal conductors at a temperature low enough to avoid damaging the substrate.

Abstract: Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.

Abstract: A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (TOM). These compositions can be applied by any convenient printing process to produce patterns of electrical conductors on temperature-sensitive electronic substrates. The patterns can be thermally cured in seconds to form pure metal conductors at a temperature low enough to avoid damaging the substrate.

Abstract: PARMOD.TM. materials comprised of a metal powder or metal powder mixture of specified characteristics and a Reactive Organic Medium, are easily printed or deposited on electronic components, such as a Printed Wiring Board substrate, and cured at low temperatures to form a highly conductive, well bonded, well consolidated pure metal component. The adhesion of PARMOD.TM. conductors on an electronic component is enhanced by printing the PARMOD.TM. on a polyimide coating which has been applied to the electronic component.

Abstract: There is provided a process for increasing the Cetane Index of a distillate fraction by reacting the fraction with hydrogen over a catalyst comprising a hydrogenation component, such as platinum, and zeolite Beta. The process results in the selective ring opening of cyclic compounds, such as aromatics, with a minimum of cracking of paraffinic hydrocarbons.