Abstract: A semiconductor substrate for an ink jet printhead. The substrate includes a silicon substrate having a thickness ranging from about 500 to about 900 microns and having a first surface and a second surface opposite the first surface. One or more ink feed slots are formed in the silicon substrate from the first surface to the second surface thereof. The ink feed slots have a first width dimension, opposing first ends, and a first length dimension between the opposing first ends adjacent the first surface of the substrate. Stress relieving openings are provided adjacent the opposing first ends of the ink feed slots. The stress relieving openings provide an overall feed slot length dimension, have a radius greater than the first width dimension of the ink feed slots and have a radius to first length dimension ratio ranging from about 1:60 to about 1:250.