Abstract: This invention relates to a lubricating oil composition comprising or resulting from the admixing of: a) 50 to 99 mass % of one or more base oils; b) 0.1 to 15 mass % of one or more functionalized olefin copolymer having an Mn of from 10,000 to 35,000 g/mol; c) 0.1 to 20 mass % of one or more detergents wherein the detergent comprises at least one calcium detergent having a TBN of more than 100 mg KOH/g; at least one calcium detergent having a TBN of 100 mg KOH/g or less; and at least one magnesium detergent, where the difference in the TBN's for the Ca detergents is at least 100 mg KOH/g; d) 0.01 to 40 mass % of one or more dispersants wherein the dispersants comprise at least one borated dispersant and at least one non borated dispersant; e) 0.01 to 20 of mass % sulfurized fatty acid ester; f) 0.01 to 5 mass % of one or more amine or phenol based antioxidants; and g) 0.001 to 15 mass % of molybdenum containing compound, where the lubricating oil composition has: 1) a sulfated ash content of 0.

Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.

Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.

Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.

Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.

Abstract: A process for the manufacture of a multi-layer polymer optical fiber having a graded optical refractive index profile. This fiber is comprised of an inner core layer, one or more intermediate layers and an outer clad layer, each layer being extruded from a polymer material. All layers are arranged in a concentric configuration, with the outer clad layer enclosing all other layers.

Abstract: A method for fabricating a single mode fiber preform is described. The method consists of placing a core rod in a glass lathe, sliding a barrier tube over the core rod, partially attaching the barrier tube to the core rod, rotating and heating the barrier tube, and traversing the heat source until the barrier tube collapses onto the core rod. A second tube of high purity quartz called a primary jacket tube is then slipped over the combination fabricated from the core rod and barrier tube, rotating and heating the primary jacket tube, and traversing the heat source until the primary jacket tube collapses onto the barrier tube.