Abstract: A spring clip for urging an electrical component onto a heat sink housing within an electronics component module is described. The spring clip comprises an elongated planar body, retention device for securing the body of the spring clip to the heat sink housing, the retention device depending downward from the body. The spring clip also includes urging device for contacting and urging the electrical component into a heat conducting relationship with the heat sink housing. The urging device includes a first elongate member depending downward from the body to a u-shaped junction. A second elongate member, extending upward from the u-shaped member and terminating at a contact surface, maintains the electrical component in a heat conducting relationship with the heat sink housing.

Abstract: A connector is provided for being connected to a printed circuit board and mounting thereto a high current device, such as a MOSFET, so that high current conducted through the device does not pass through circuit paths on the circuit board. The connector includes a housing having first and second ports formed therein. A plurality of first electrical conductors are mounted in the housing. Each of the first conductors has a first end extending into one of the first and second ports and a second end extending out from the housing to the printed circuit board for being connected to a circuit path on the board. A plurality of second electrical conductors are also mounted in the housing. Each of the second conductors has a first end extending into the first port and a second end extending into the second port. The connector further includes a plurality of device conductors which are mounted in the housing.