Patents by Inventor Gregory A. Theis
Gregory A. Theis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11938017Abstract: Devices, systems, and methods to improve both the reliability of soft tissue repair procedures and the speed at which the procedures are completed are provided. The devices and systems include one or more tissue augmentation constructs, which include constructs that are configured to increase a footprint across which suture applied force to tissue when the suture is tied down onto the tissue. The tissue augmentation constructs can be quickly and easily associated with the repair suture, and can be useful in many different tissue repair procedures that are disclosed in the application. Tissue augmentation constructs can include various blocks and scaffolds, among other formations. The present disclosure includes, among other disclosures, methods for using tissue augmentation scaffolds, including folding scaffolds, and descriptions and methods associated with extra-wide tissue augmentation blocks.Type: GrantFiled: October 28, 2022Date of Patent: March 26, 2024Assignee: MEDOS INTERNATIONAL SRLInventors: Gregory R. Whittaker, Mehmet Ziya Sengun, Benjamin Cleveland, Cody Cranson, Reagan A. Theis
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Patent number: 11937803Abstract: Devices, systems, and methods to improve both the reliability of soft tissue repair procedures and the speed at which the procedures are completed are provided. The devices and systems include one or more tissue augmentation constructs, which include constructs that are configured to increase a footprint across which suture applied force to tissue when the suture is tied down onto the tissue. The tissue augmentation constructs can be quickly and easily associated with the repair suture, and can be useful in many different tissue repair procedures that are disclosed in the application. In one exemplary embodiment, one or more constructs are disposed on a suture threader, which can be used to associate the construct(s) with a repair suture(s) being used to repair the soft tissue. Tissue augmentation constructs can include various blocks and patches, among other formations. Exemplary methods for manufacturing the tissue augmentation constructs are also provided.Type: GrantFiled: November 15, 2022Date of Patent: March 26, 2024Assignee: Medos International SarlInventors: Mehmet Ziya Sengun, Gregory R. Whittaker, Benjamin Cleveland, Stefano Berti, Justin Piccirillo, Reagan A. Theis
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Publication number: 20100285697Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.Type: ApplicationFiled: July 21, 2010Publication date: November 11, 2010Applicant: Medtronic, Inc.Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
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Publication number: 20090017700Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.Type: ApplicationFiled: September 24, 2008Publication date: January 15, 2009Applicant: Medtronic, Inc.Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
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Patent number: 7472505Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.Type: GrantFiled: August 21, 2007Date of Patent: January 6, 2009Assignee: Medtronic, Inc.Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
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Publication number: 20070293099Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.Type: ApplicationFiled: August 21, 2007Publication date: December 20, 2007Inventors: Bryan Zart, Brian Burwick, Andrew Ries, John Nicholson, Jay Lahti, Gregory Theis
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Patent number: 7309262Abstract: A connector assembly for coupling to an implantable medical device includes a core element formed of a first thermoplastic material shaped to receive a connector member for receiving a lead. The connector assembly further includes a circuit member positioned adjacent to the core element. The circuit member includes a portion extending along the core element to the connector member and an antenna structure extending over a portion of the core element outer surface.Type: GrantFiled: January 29, 2007Date of Patent: December 18, 2007Assignee: Medtronic, Inc.Inventors: Bryan J. Zart, Andrew J. Ries, Brian R. Burwick, John E. Nicholson, Jay K. Lahti, Gregory A. Theis
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Publication number: 20070190866Abstract: A connector assembly for coupling to an implantable medical device includes a core element formed of a first thermoplastic material shaped to receive a connector member for receiving a lead. The connector assembly further includes a circuit member positioned adjacent to the core element. The circuit member includes a portion extending along the core element to the connector member and an antenna structure extending over a portion of the core element outer surface.Type: ApplicationFiled: January 29, 2007Publication date: August 16, 2007Inventors: Bryan Zart, Andrew Ries, Brian Burwick, John Nicholson, Jay Lahti, Gregory Theis
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Publication number: 20070087637Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.Type: ApplicationFiled: December 18, 2006Publication date: April 19, 2007Inventors: Bryan Zart, Brian Burwick, Andrew Ries, John Nicholson, Jay Lahti, Gregory Theis
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Patent number: 7175482Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.Type: GrantFiled: October 15, 2004Date of Patent: February 13, 2007Assignee: Medtronic, Inc.Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
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Publication number: 20050137642Abstract: An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts.Type: ApplicationFiled: October 15, 2004Publication date: June 23, 2005Inventors: Bryan Zart, Brian Burwick, Andrew Ries, John Nicholson, Jay Lahti, Gregory Theis
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Patent number: 6817905Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.Type: GrantFiled: June 20, 2001Date of Patent: November 16, 2004Assignee: Medtronic, Inc.Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
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Publication number: 20030069612Abstract: An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts.Type: ApplicationFiled: June 20, 2001Publication date: April 10, 2003Inventors: Bryan J. Zart, Brian R. Burwick, Andrew J. Ries, John E. Nicholson, Jay Lahti, Gregory A. Theis
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Patent number: 5944211Abstract: A container system includes a one-piece, one-way valve. The container system can be evacuated by pressing the lid, thereby forcing air out of the one-way valve. The one-way valve does not allow air to enter the container system. The one-way valve includes an interface or release which allows air to enter the container system when the interface is pressed. The one-way valve is preferably an umbrella-shaped valve made of a silicone or plastic.Type: GrantFiled: August 26, 1997Date of Patent: August 31, 1999Assignee: Anchor Hocking Plastics/Plastics Inc.Inventors: Brian E. Woodnorth, Gregory A. Theis, Roger A. Leenerts, Richard O. McCarthy, Nick E. Stanca
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Patent number: D369791Type: GrantFiled: June 20, 1994Date of Patent: May 14, 1996Assignee: Minnesota Mining and Manufacturing CompanyInventors: James J. Wulfing, Craig A. Bane, Gregory A. Theis