Abstract: A system and method is disclosed for bonding a substrate to a semiconductor die that is prone to curling when subjected to an elevated temperature in a solder reflow oven, for example, thereby improving the electrical and mechanical bonding for large dies, wafers, chips, and photovoltaic cells. In one embodiment, the substrate is adapted to curl to the same degree as the die to form a uniform gap between the substrate and die across the boundary there between. In another embodiment, solder used to bond the die and substrate is applied such that the volume deposited varies based on the expected gap between the die and substrate when heated to the melting temperature of the solder.

Abstract: A system and method is disclosed for bonding a substrate to a semiconductor die that is prone to curling when subjected to an elevated temperature in a solder reflow oven, for example, thereby improving the electrical and mechanical bonding for large dies, wafers, chips, and photovoltaic cells. In one embodiment, the substrate is adapted to curl to the same degree as the die to form a uniform gap between the substrate and die across the boundary there between. In another embodiment, solder used to bond the die and substrate is applied such that the volume deposited varies based on the expected gap between the die and substrate when heated to the melting temperature of the solder.

Abstract: A system and method is disclosed for bonding a substrate to a semiconductor die that is prone to curling when subjected to an elevated temperature in a solder reflow oven, for example, thereby improving the electrical and mechanical bonding for large dies, wafers, chips, and photovoltaic cells. In one embodiment, the substrate is adapted to curl to the same degree as the die to form a uniform gap between the substrate and die across the boundary there between. In another embodiment, solder used to bond the die and substrate is applied such that the volume deposited varies based on the expected gap between the die and substrate when heated to the melting temperature of the solder.

Abstract: A system and method for reducing power losses in a semiconductor device, especially a photovoltaic cell. The system includes a semiconductor device that includes at least one conductive crossbar with a pattern and a substrate that includes similarly patterned supplemental crossbars. The crossbars are coated with the adhesive solder paste and superimposed on each other. The adhesive solder paste when heated forms a conductive path between the crossbars and the supplemental crossbars while simultaneously adhering the crossbars and the supplemental crossbars together. Thereafter an under-fill material is deposited into voids defined by gaps between the semiconductor device and the backplate.