Abstract: A blind pull type fastener includes a pin, a sleeve, a collar, and a bulb-forming portion. The pin includes a head. The pin is pulled so that the head applies force to the bulb-forming portion. The bulb-forming portion is deformed to form a bulb. The collar is deformed into a void of the sleeve. The pin includes locking rings. The collar is deformed to lock with the locking rings.

Abstract: A blind pull type fastener includes a pin, a sleeve, a collar, and a bulb-forming portion. The pin includes a head. The pin is pulled so that the head applies force to the bulb-forming portion. The bulb-forming portion is deformed to form a bulb. The collar is deformed into a void of the sleeve. The pin includes locking rings. The collar is deformed to lock with the locking rings.

Abstract: A blind tacking rivet includes a stem and a sleeve. The stem includes a body and a stem head. The stem head is removable from the body. The stem head deforms a portion of the sleeve during removal of the stem head. The stem head may be discarded or may be embedded within the sleeve.

Abstract: A blind tacking rivet includes a stem and a sleeve. The stem includes a body and a stem head. The stem head is removable from the body. The stem head deforms a portion of the sleeve during removal of the stem head. The stem head may be discarded or may be embedded within the sleeve.

Abstract: A method of dipping a nanoscopic probe comprising dipping a nanoscopic tip at a dipping rate into an inkwell comprising ink, wherein the dipping rate is configured to be sufficiently faster than a rate of wicking. A nanoscopic probe comprising a nanoscopic tip and an inkwell configured to contain ink, wherein the nanoscopic probe is configured to dip into and retract from the ink at a rate that is sufficiently faster than wicking. Wicking can cause excessive amounts of ink to be deposited on nanoscopic tips, which can lead to contamination of inkwells and other nanoscopic tips.

Abstract: A method of dipping a nanoscopic probe comprising dipping a nanoscopic tip at a dipping rate into an inkwell comprising ink, wherein the dipping rate is configured to be sufficiently faster than a rate of wicking. A nanoscopic probe comprising a nanoscopic tip and an inkwell configured to contain ink, wherein the nanoscopic probe is configured to dip into and retract from the ink at a rate that is sufficiently faster than wicking. Wicking can cause excessive amounts of ink to be deposited on nanoscopic tips, which can lead to contamination of inkwells and other nanoscopic tips.

Abstract: A focused particle beam system, according to one embodiment of the invention, precisely shapes a pole-tip assembly formed by a multi-layer device having a first layer with a first structural element, a second layer with a second structural element, and a shielding layer with a shielding element, the shielding element being located between the first layer and the second layer. The focused particle beam system mills the second structural element without irradiating a first structural element. The system images a selected portion of the multi-layer device to locate the shielding element and thereby avoids irradiating the first structural element. The shielding element separates the first structural element from the second structural element. Based on the location of the shielding element, the system images and mills the second structural element without irradiating the first structural element.