Abstract: This invention relates to comfortable ophthalmic devices and methods of producing such devices.

Abstract: This invention relates to comfortable ophthalmic devices and methods of producing such devices.

Abstract: Embodiments of the disclosure are directed to compositions and methods for enhancing disease resistance in plants. One aspect of embodiments of the disclosure relates to a nucleic acid construct comprising a nucleic acid molecule comprising a Pseudomonas tomato race 1 (Ptr1) polynucleotide, a 5? heterologous DNA promoter sequence, and a 3? terminator sequence, wherein the nucleic acid molecule, the DNA promoter sequence, and the terminator sequence are operatively coupled to permit transcription of the nucleic acid molecule. Methods of imparting disease resistance to a plant and methods of identifying a candidate plant suitable for breeding that displays enhanced disease resistance are also disclosed. Embodiments of the disclosure also include plant cells, plants, and plant seeds including a heterologous Pseudomonas tomato race 1 (Ptr1) polynucleotide.

Abstract: One aspect of the present invention relates to a nucleic acid construct that includes a nucleic acid molecule that encodes FLAGELLIN-SENSING 3 (“FLS3”) protein; a 5? heterologous DNA promoter sequence; and a 3? terminator sequence, where the nucleic acid molecule, the DNA promoter sequence, and the terminator sequence are operatively coupled to permit transcription of the nucleic acid molecule. The present invention also relates to a method of imparting disease resistance to a plant. This method involves transforming a plant or a plant seed with a nucleic acid molecule that increases expression of an FLS3 protein, where said transforming is effective in imparting disease resistance to the transformed plant or to a transgenic plant produced from the transformed plant seed.

Abstract: One aspect of the present invention relates to a nucleic acid construct that includes a nucleic acid molecule that encodes FLAGELLIN-SENSING 3 (“FLS3”) protein; a 5? heterologous DNA promoter sequence; and a 3? terminator sequence, where the nucleic acid molecule, the DNA promoter sequence, and the terminator sequence are operatively coupled to permit transcription of the nucleic acid molecule. The present invention also relates to a method of imparting disease resistance to a plant. This method involves transforming a plant or a plant seed with a nucleic acid molecule that increases expression of an FLS3 protein, where said transforming is effective in imparting disease resistance to the transformed plant or to a transgenic plant produced from the transformed plant seed.

Abstract: The present invention relates to a bacterial effector protein which inhibits programmed cell death in eukaryotes and a nucleic acid molecule encoding such a protein. The present invention also relates to methods of suppressing programmed cell death in eukaryotes, delaying senescence in plants, and increasing protein expression in plants. The present invention further relates to a nucleic acid construct having a nucleic acid molecule encoding a first protein, which suppresses immunity by inhibition of programmed cell death in eukaryotes, coupled to a nucleic acid molecule encoding a second protein which is toxic when expressed in eukaryotes. Additionally, the present invention provides a method of stabilizing a transgenic plant transformed with such a nucleic acid construct. Finally, the present invention provides a method of treating subjects for a condition mediated by programmed cell death involving administering to the subject a bacterial effector protein which inhibits programmed cell death.

Abstract: The present invention relates to isolated nucleic acid molecules encoding a type III—secreted bacterial protein capable of modifying a cell death pathway in a plant cell. One aspect of the present invention involves an isolated nucleic acid molecule having a nucleotide sequence that encodes the HopPtoD2 protein of Pseudomonas syringae pv. syringae DC 3000. Expression vectors, host cells, and transgenic plants which include the DNA molecules of the present invention are also disclosed. The nucleic acid molecules of the present invention can be used to impart disease resistance to a plant and to make a plant hypersusceptible to colonization by nonpathogenic bacteria.

Abstract: Replacements of thick film pads with smaller, thinner, metal contacts or straps are used to eliminate many of the stress-related failure modes associated with the larger contact pads. These straps allow for a more simplified manufacturing process than that associated with an anchored I/O pad configuration. A single via, electrically connected to a plurality of vias in a substrate layer above, is introduced to enhance the reliability of the signal net, and provides for higher frequency applications through reduction in parasitic capacitance and electrical leakage. The straps are directionally located toward the substrate center. Once the locations of the internal strap vias are redirected to lower local distance-to-neutral points, still within the same I/O capture pad, and directed towards the center of the substrate, single vias are then placed at the strap end closest the substrate center.

Abstract: A method of forming an electrical connection between two devices is disclosed. In an exemplary embodiment of the invention, the method includes soldering a second solderable cap of an interconnection to a first contact pad of a first component. The interconnection further includes a conductive polymer comprising a polymer component and a conductive component A first solderable cap is disposed in contact with the conductive polymer, and the second solderable cap is disposed in contact with the conductive polymer opposite the first solderable cap. The first solderable cap is then soldered to a second contact pad of a second component.

Abstract: Replacements of thick film pads with smaller, thinner, metal contacts or straps are used to eliminate many of the stress-related failure modes associated with the larger contact pads. These straps allow for a more simplified manufacturing process than that associated with an anchored I/O pad configuration. A single via, electrically connected to a plurality of vias in a substrate layer above, is introduced to enhance the reliability of the signal net, and provides for higher frequency applications through reduction in parasitic capacitance and electrical leakage. The straps are directionally located toward the substrate center. Once the locations of the internal strap vias are redirected to lower local distance-to-neutral points, still within the same I/O capture pad, and directed towards the center of the substrate, single vias are then placed at the strap end closest the substrate center.

Abstract: Compositions and methods of use for the expression of plant pathogen defense-related and signaling genes are provided. The compositions include nucleotide sequences identified from tomato that show specific patterns of gene expression associated with the Avr-Pto mediated defense response in tomato plants resistant to bacterial speck disease caused by Pseudomonas syringae pathovar tomato [strain T1(A)]. The nucleotide sequences are specific to genes that are up-regulated or down-regulated in response to the interaction of AvrPto and Pto in the presence of Prf. These compositions have agricultural utility for increasing resistance to a variety of biotic and abiotic stresses, including plant pathogens.

Abstract: The present invention relates to methods and materials for the protection of plants against pathogens through plant genetic engineering, and more particularly to genes which enhance disease resistance in plants by encoding proteins that physically interact with R gene products involved in activation of plant defense mechanisms. The invention further relates to three nucleotide sequences which have been cloned, isolated and sequenced, three amino acid sequences encoded thereby and a transgenic plant and methods for making the same, the genome of the plant having incorporated therein a foreign nucleotide sequence selected in accordance with the invention which functions to enhance the plant's ability to resist pathogens.

Abstract: One aspect of the present invention relates to isolated nucleic acid molecules encoding avirulence proteins or polypeptides of Pseudomonas syringae pv. syringae DC 3000, or nucleic acid molecules which are complementary thereto. Expression vectors, host cells, and transgenic plants which include the DNA molecules of the present invention are also disclosed. Another aspect relates to the isolated proteins or polypeptides and compositions containing the same. The nucleic acid molecules and proteins of the present invention can be used to impart disease resistance to a plant.

Abstract: The present invention relates to methods and materials for the protection of plants against pathogens through plant genetic engineering; and more particularly to genes which enhance disease resistance in plants by encoding proteins that physically interact with R gene products involved in activation of plant defense mechanisms. The invention further relates to three nucleotide sequences which have been cloned, isolated and sequenced, three amino acid sequences encoded thereby and a transgenic plant and methods for making the same, the genome of the plant having incorporated therein a foreign nucleotide sequence selected in accordance with the invention which functions to enhance the plant's ability to resist pathogens.

Abstract: The present invention relates generally to an electrical interconnection package and a method thereof. More particularly, the invention encompasses an invention that increases the fatigue life of a Ball Grid Array (BGA) electrical interconnection. This invention structurally couples at least one module to an organic interposer using a high modulus underfill material. The organic interposer is then joined to a organic board using standard joining processes. The inventive module can then be removed from the organic board at any time by moving the organic interposer using standard rework techniques.

Abstract: Disclosed herein is an interconnection for electrical connection of two electrical devices. The interconnection comprises a conductive polymer disposed in contact with one or two solderable caps. Together, the solderable cap(s) and the conductive polymer form an interconnection that can be used to connect two electrical devices through the contact pads on the electrical devices. For example, a packaged integrated circuit chip can be connected to a “card” using an array of the interconnections. Since the interconnection has solderable surfaces, the interconnect can be used in place of solder balls in a conventional manufacturing line.

Abstract: This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.

Abstract: This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.

Abstract: A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.

Abstract: A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.