Patents by Inventor Gregory Barner

Gregory Barner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRODUCING AN ELECTROMAGNETIC ISOLATION CAVITY BY STACKING TAPE LAYERS HAVING CONDUCTOR-COATED EDGE SURFACES FACING THE CAVITY
    Publication number: 20140231005
    Abstract: An electromagnetic isolation cavity surrounded by a generally annular solid conductive wall is produced by coating edge surfaces of respective dielectric tape layers with a material containing a conductor. The tape layers are then stacked, with the coated edge surfaces aligned and facing the electromagnetic isolation cavity.
    Type: Application
    Filed: April 30, 2014
    Publication date: August 21, 2014
    Applicant: Sandia Corporation
    Inventors: Kenneth A. Peterson, Richard T. Knudson, Frank R. Smith, Gregory Barner
  • Full tape thickness feature conductors for EMI structures
    Patent number: 8747591
    Abstract: Generally annular full tape thickness conductors are formed in single or multiple tape layers, and then stacked to produce an annular solid conductive wall for enclosing an electromagnetic isolation cavity. The conductors may be formed using punch and fill operations, or by flowing conductor-containing material onto the tape edge surfaces that define the interior sidewalls of the cavity.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: June 10, 2014
    Assignee: Sandia Corporation
    Inventors: Kenneth A. Peterson, Richard T. Knudson, Frank R. Smith, Gregory Barner
  • Method of creating multi-layered monolithic circuit structure containing integral buried and trimmed components
    Publication number: 20050208706
    Abstract: A method of creating a multi-layered monolithic circuit structure wherein individual layers of standard alumina thick film ceramic substrate and the resistors, inductors, capacitors, and other circuit componentry printed thereon are fired, and the circuit componentry trimmed or otherwise adjusted to achieve a desired degree of precision prior to combining the layers with a thick film glass bonding agent to form the monolithic structure.
    Type: Application
    Filed: March 17, 2004
    Publication date: September 22, 2005
    Inventors: Roy Blazek, Gregory Barner, Sam Bandler, Eric Eubank, Fernando Uribe, Patrick Smith