Abstract: A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

Abstract: A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature capable contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

Abstract: A method of fabricating an integrated device including a MicroElectroMechanical system (MEMS) and an associated microcircuit is provided. In one embodiment, the method comprises: forming a high temperature capable contact through a dielectric layer to an underlying element of a microcircuit formed adjacent to a MicroElectroMechanical System (MEMS) structure on a substrate; and depositing a layer of conducting material over the dielectric layer, and patterning the layer of conducting material to form a local interconnect (LI) for the microcircuit overlying and electrically coupled to the contact and a bottom electrode for the adjacent MEMS structure. Other embodiments are also provided.

Abstract: A method is provided for fabricating micro-electromechanical devices. Generally, the method includes: (i) forming a device layer over a sacrificial layer on a surface of a substrate; (ii) patterning the device layer to form a number of ribbons each including a long axis parallel to the surface of the substrate and a middle section between support structures at both ends of the ribbon; (iii) partially removing the sacrificial layer to undercut the number of ribbons; (iv) forming a reflective coating of a reflective material on the number of ribbons; and (v) releasing the middle section of at least one of the number of ribbons by removing the sacrificial layer. Undercutting the ribbons prior to forming the reflective coating reduces build-up of material on sidewalls of the sacrificial layer facilitating release of the ribbons. Other embodiments are also disclosed.

Abstract: In one embodiment disclosed, a light modulator can be configured to have a substantially flat optically active modulator element portion while deflected. The modulator can include a plurality of modulator elements arranged substantially in parallel, with each modulator element including an optically active portion and a support portion on either side of the optically active portion. Further, the optically active portion can have a narrower width than the support portion. In another embodiment disclosed, a movable membrane for light modulation includes a substantially circular optically active portion and a released membrane portion surrounding the circular optically active portion. The substantially circular optically active portion can also include a plurality of gaps configured to expose a lower surface. Further, the substantially circular optically active portion can be essentially flat while in a deflected state.

Abstract: In one embodiment, a method of forming a metallic electrode comprises depositing a metal layer over a surface (e.g., substrate) and thermally processing the metal layer to form a conductive metallized ceramic. The metal layer may be deposited by sputtering and thermally processed by rapid thermal processing, for example. Among other advantages, embodiments of the present invention allow for the formation of conductive metallized ceramics, such as titanium-nitride, without the use of relatively expensive deposition tools.