Abstract: Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperature metal-containing paste adjacent to a first component. A second layer of a second high temperature metal-containing paste is disposed adjacent to a second component. A nanostructured multilayer reactive foil is disposed between the first and second layers. The nanostructured multilayer reactive foil is activated to sinter the first and second layers and bond the first and second components.

Abstract: A power module system for a vehicle includes a circuit board, a power transistor mounted to the circuit board, and a temperature sensor mounted to the circuit board in a sensing location remote from the power transistor. The temperature sensor is configured to measure a real-time temperature at the sensing location. The system also includes a processor coupled to the temperature sensor to generate a predicted real-time silicon temperature for the power transistor from the measured real-time temperature at the sensing location. The predicted real-time silicon temperature is generated using a selected calibration curve that corresponds to a current operating state of the vehicle.

Abstract: Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components are provided herein. In one example, a method of bonding components for fabricating an electronic assembly comprises the steps of disposing a first layer of a first high temperature metal-containing paste adjacent to a first component. A second layer of a second high temperature metal-containing paste is disposed adjacent to a second component. A nanostructured multilayer reactive foil is disposed between the first and second layers. The nanostructured multilayer reactive foil is activated to sinter the first and second layers and bond the first and second components.

Abstract: A power module system for a vehicle includes a circuit board, a power transistor mounted to the circuit board, and a temperature sensor mounted to the circuit board in a sensing location remote from the power transistor. The temperature sensor is configured to measure a real-time temperature at the sensing location. The system also includes a processor coupled to the temperature sensor to generate a predicted real-time silicon temperature for the power transistor from the measured real-time temperature at the sensing location. The predicted real-time silicon temperature is generated using a selected calibration curve that corresponds to a current operating state of the vehicle.

Abstract: A method for cooling an inverter of a vehicle system includes the steps of providing a flow of cooling fluid to the inverter, determining a value of a variable that is influenced at least in part by the flow of cooling fluid to the inverter, and regulating the flow of cooling fluid to the inverter based at least in part on the value of the variable.