Patents by Inventor Gregory E. Dermer

Gregory E. Dermer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8745306
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: June 3, 2014
    Assignee: Intel Corporation
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Publication number: 20120317328
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Application
    Filed: August 21, 2012
    Publication date: December 13, 2012
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Patent number: 8255605
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BICS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: August 28, 2012
    Assignee: Intel Corporation
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H Hofsheier, Nitin Y. Borkar
  • Publication number: 20110185101
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Application
    Filed: March 30, 2011
    Publication date: July 28, 2011
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Patent number: 7930464
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: April 19, 2011
    Assignee: Intel Corporation
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Publication number: 20090319717
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Application
    Filed: August 28, 2009
    Publication date: December 24, 2009
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Patent number: 7603508
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Grant
    Filed: January 14, 2008
    Date of Patent: October 13, 2009
    Assignee: Intel Corporation
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Patent number: 7343442
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Grant
    Filed: June 6, 2006
    Date of Patent: March 11, 2008
    Assignee: Intel Corporation
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Patent number: 7058750
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Grant
    Filed: May 10, 2000
    Date of Patent: June 6, 2006
    Assignee: Intel Corporation
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Patent number: 6798265
    Abstract: A low jitter external clocking system and method are disclosed. According to one embodiment of the present invention, a differential clock signal is received on a first clock signal line and a second clock signal line. A differential amplifier coupled to the first clock signal line and the second clock signal line amplifies the differential clock signal into a single-ended output clock signal.
    Type: Grant
    Filed: April 25, 2002
    Date of Patent: September 28, 2004
    Assignee: Intel Corporation
    Inventors: Rajendran Nair, Gregory E. Dermer, Stephen R. Mooney, Nitin Y. Borkar
  • Publication number: 20020125930
    Abstract: A low jitter external clocking system and method are disclosed. According to one embodiment of the present invention, a differential clock signal is received on a first clock signal line and a second clock signal line. A differential amplifier coupled to the first clock signal line and the second clock signal line amplifies the differential clock signal into a single-ended output clock signal.
    Type: Application
    Filed: April 25, 2002
    Publication date: September 12, 2002
    Applicant: Intel Corporation
    Inventors: Rajendran Nair, Gregory E. Dermer, Stephen R. Mooney, Nitin Y. Borkar
  • Patent number: 6415388
    Abstract: A method and apparatus for power throttling in a microprocessor. A voltage source supplies voltage to the microprocessor, and a clock source operates the microprocessor at a desired frequency. In one embodiment, a power monitor is configured to measure the short term power consumption of the microprocessor. In another embodiment, a temperature sensor measures the temperature of the microprocessor. Control logic is coupled to the voltage source and the clock source. The control logic receives an indication of the power consumption or temperature, as applicable, and compares it to a predetermined value. In response to the comparison, the control logic varies the supply voltage and the frequency.
    Type: Grant
    Filed: October 30, 1998
    Date of Patent: July 2, 2002
    Assignee: Intel Corporation
    Inventors: Chris S. Browning, Shekhar Y. Borkar, Gregory E. Dermer
  • Patent number: 6411151
    Abstract: A low jitter external clocking system and method are disclosed. According to one embodiment of the present invention, a differential clock signal is received on a first clock signal line and a second clock signal line. A differential amplifier coupled to the first clock signal line and the second clock signal line amplifies the differential clock signal into a single-ended output clock signal.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: June 25, 2002
    Assignee: Inter Corporation
    Inventors: Rajendran Nair, Gregory E. Dermer, Stephen R. Mooney, Nitin Y. Borkar
  • Patent number: 6330680
    Abstract: A method and apparatus for power throttling in a microprocessor. A voltage source supplies voltage to the microprocessor, and a clock source operates the microprocessor at a desired frequency. In one embodiment, a power monitor is configured to measure the short term power consumption of the microprocessor. In another embodiment, a temperature sensor measures the temperature of the microprocessor. Control logic is coupled to the voltage source and the clock source. The control logic receives an indication of the power consumption or temperature, as applicable, and compares it to a predetermined value. In response to the comparison, the control logic varies the supply voltage and the frequency.
    Type: Grant
    Filed: October 30, 1998
    Date of Patent: December 11, 2001
    Assignee: Intel Corporation
    Inventors: Chris S. Browning, Shekhar Y. Borkar, Gregory E. Dermer
  • Patent number: 4774659
    Abstract: A system and method for implementing virtual memory in a computer system, wherein a table containing entries indicative of the correlation of virtual memory addresses to physical memory addresses is maintained in main memory, and translation descriptors, derived from the translation table entries, for a variable group of virtual addresses, is maintained in a high speed memory. Portions of a virtual address to be translated are compared to the translation descriptors in the high speed memory. If a matching translation descriptor is found, the corresponding physical address is determined by combining a portion of the virtual address with a portion of the matching translation descriptor. If a matching descriptor is not found, a software algorithm is employed to generate a translation descriptor for the virtual address from the table in main memory. The generated translation descriptor is then installed in the high speed memory, the comparison repeated, and the corresponding physical address generated.
    Type: Grant
    Filed: April 16, 1986
    Date of Patent: September 27, 1988
    Assignee: Astronautics Corporation of America
    Inventors: James E. Smith, Gregory E. Dermer, Michael A. Goldsmith