Patents by Inventor Gregory E. Scott

Gregory E. Scott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11925373
    Abstract: A surgical suturing system is disclosed. The surgical suturing system comprises a shaft comprising a shaft diameter, a firing drive, and an end effector extending distally from the shaft. The end effector comprises a needle track and a needle comprising suturing material attached thereto, wherein the needle is configured to be guided by the needle track and actuated by the firing drive through a firing stroke, and wherein the needle is movable along a needle path comprising a maximum capture width which is greater than the shaft diameter.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: March 12, 2024
    Assignee: Cilag GmbH International
    Inventors: Andrew C. Deck, Frederick E. Shelton, IV, Gregory J. Bakos, Nicholas M. Morgan, Gregory G. Scott, Asaad Hossain
  • Patent number: 11911045
    Abstract: A method for adjusting control parameters of a clip applier using a surgical hub is disclosed. The method comprises gathering data during a first surgical procedure, evaluating the gathered data to determine the appropriate operation of a clip applier in a subsequent surgical procedure, gathering data during the operation of the clip applier in the subsequent surgical procedure, determining if the operation of the clip applier needs to be adjusted based on the data gathered during the subsequent surgical procedure, and adjusting the operation of the clip applier based on the data gathered during the subsequent surgical procedure.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: February 27, 2024
    Assignee: Cllag GmbH International
    Inventors: Frederick E. Shelton, IV, Michael J. Stokes, Gregory G. Scott, Nicholas M. Morgan, Disha V. Estera, Jason L. Harris, Chester O. Baxter, III, Daniel J. Mumaw
  • Patent number: 11490506
    Abstract: One embodiment provides a printed circuit board (PCB). The PCB can include one or more metal layers and at least a pair of differential transmission lines. The pair of differential transmission lines can include a first transmission line and a second transmission line. The first transmission line can include a plurality of timing-skew-compensation structures, and a respective timing-skew-compensation structure of the first transmission line or a corresponding segment of the second transmission line adjacent to the timing-skew-compensation structure has a non-uniform width.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: November 1, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Hyunjun Kim, Andrew J. Becker, Paul Taylor Wildes, Gregory E. Scott
  • Publication number: 20200375025
    Abstract: One embodiment provides a printed circuit board (PCB). The PCB can include one or more metal layers and at least a pair of differential transmission lines. The pair of differential transmission lines can include a first transmission line and a second transmission line. The first transmission line can include a plurality of timing-skew-compensation structures, and a respective timing-skew-compensation structure of the first transmission line or a corresponding segment of the second transmission line adjacent to the timing-skew-compensation structure has a non-uniform width.
    Type: Application
    Filed: May 21, 2020
    Publication date: November 26, 2020
    Inventors: Hyunjun Kim, Andrew J. Becker, Paul Taylor Wildes, Gregory E. Scott
  • Patent number: 8885357
    Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: November 11, 2014
    Assignee: Cray Inc.
    Inventors: Hyunjun Kim, Jeffrey S. Conger, Gregory E. Scott
  • Publication number: 20130175077
    Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.
    Type: Application
    Filed: January 6, 2012
    Publication date: July 11, 2013
    Inventors: Hyunjun Kim, Jeffrey S. Conger, Gregory E. Scott