Patents by Inventor Gregory E. Scott

Gregory E. Scott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Skew compensation apparatus for controlling transmission line impedance
    Patent number: 11490506
    Abstract: One embodiment provides a printed circuit board (PCB). The PCB can include one or more metal layers and at least a pair of differential transmission lines. The pair of differential transmission lines can include a first transmission line and a second transmission line. The first transmission line can include a plurality of timing-skew-compensation structures, and a respective timing-skew-compensation structure of the first transmission line or a corresponding segment of the second transmission line adjacent to the timing-skew-compensation structure has a non-uniform width.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: November 1, 2022
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Hyunjun Kim, Andrew J. Becker, Paul Taylor Wildes, Gregory E. Scott
  • SKEW COMPENSATION APPARATUS FOR CONTROLLING TRANSMISSION LINE IMPEDANCE
    Publication number: 20200375025
    Abstract: One embodiment provides a printed circuit board (PCB). The PCB can include one or more metal layers and at least a pair of differential transmission lines. The pair of differential transmission lines can include a first transmission line and a second transmission line. The first transmission line can include a plurality of timing-skew-compensation structures, and a respective timing-skew-compensation structure of the first transmission line or a corresponding segment of the second transmission line adjacent to the timing-skew-compensation structure has a non-uniform width.
    Type: Application
    Filed: May 21, 2020
    Publication date: November 26, 2020
    Inventors: Hyunjun Kim, Andrew J. Becker, Paul Taylor Wildes, Gregory E. Scott
  • Printed circuit board with reduced cross-talk
    Patent number: 8885357
    Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: November 11, 2014
    Assignee: Cray Inc.
    Inventors: Hyunjun Kim, Jeffrey S. Conger, Gregory E. Scott
  • PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK
    Publication number: 20130175077
    Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.
    Type: Application
    Filed: January 6, 2012
    Publication date: July 11, 2013
    Inventors: Hyunjun Kim, Jeffrey S. Conger, Gregory E. Scott