Patents by Inventor Gregory Erwin Scott

Gregory Erwin Scott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160366759
    Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.
    Type: Application
    Filed: August 18, 2014
    Publication date: December 15, 2016
    Inventors: Hyunjun Kim, Jeffrey Scott Conger, Gregory Erwin Scott
  • Publication number: 20150013155
    Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.
    Type: Application
    Filed: October 6, 2014
    Publication date: January 15, 2015
    Inventors: Hyunjun Kim, Jeffrey Scott Conger, Gregory Erwin Scott