Abstract: A method for assembling a rack column assembly comprising: positioning a first data center rack on a support surface; stacking a second data center rack atop the first data center rack; placing a first vertical column on a first lateral side of the data center racks; after said stacking, placing a second vertical column on a second lateral side of the data center racks; connecting the first vertical column to the data center racks by fastening first lateral side attachment brackets to the data center racks; and connecting the second vertical column to the data center racks by fastening second lateral side attachment brackets to the data center racks, the first lateral side attachment brackets and the second lateral side attachment brackets limiting movement of the data center racks in a depth direction of the rack column assembly. A rack column assembly is also disclosed.

Abstract: A cooling arrangement for cooling of a rack hosting an electronic device includes a first loop including a liquid cooling unit thermally coupled to a heat-generating component of the electronic device, a primary side of a liquid-to-liquid heat exchanger fluidly connected to the liquid cooling unit; and a pump fluidly connected between the primary side and the liquid cooling unit. A second loop includes a secondary side of the liquid-to-liquid heat exchanger thermally coupled to the primary side for transfer of heat from the primary side to the secondary side. A relief line selectively fluidly connects the first and second loops and is operable in: (i) a closed state whereby the relief line does not allow cooling liquid flow therethrough, and (ii) an open state whereby the relief line fluidly connects the first and second loops.

Abstract: A fixing system for fixing a liquid cooling block on a heat-generating electronic component, the fixing system comprising a mounting bracket and an indicator. The mounting bracket comprises a main portion overlying at least part of the liquid cooling block in order to urge the liquid cooling block against the heat-generating electronic component, and an outer connecting portion extending from the main portion and configured to be fastened to a substrate on which the heat-generating electronic component is disposed. The indicator is disposed between the main portion and the liquid cooling block, and undergoes deformation in response to the outer connecting portion being progressively fastened to the substrate in order to provide an indication to a user that a desired amount of pressure is exerted between the mounting bracket and the liquid cooling block for establishing adequate contact between the liquid cooling block and the heat-generating electronic component.

Abstract: The disclosed systems and structures are directed to the management of cable/tube bundles for rack-mounted liquid-cooled cases containing electronic assemblies. The management of cable/tube bundles comprises an articulating scissor structure containing a first arm detachably connected to a contact point on a backplane of a rack-mounted immersion case, a second arm detachably connected to a contact point on a backplane of a rack frame, and a joining portion connecting the first and second arms via a center axle and controllably guiding the cable/tube bundles along a pivot point of the central axle. During the de-racking of the immersion case, the articulating scissor structure is configured to laterally extend and support and guide the cable/tube bundle across a de-racked space, and during the racking of the immersion case, the articulating scissor structure is configured to laterally contract and guide the corresponding cable/tube bundle into a fixed racked space.

Abstract: An immersion tank storage system for a data center, includes: a frame defining a plurality of storage levels disposed above one another; a plurality of immersion tanks supported by the frame, each immersion tank configured to contain electronic devices and an immersion cooling liquid for cooling thereof, each storage level being configured to house first and second immersion tanks; and means for synchronously moving the first and second immersion tanks housed in at least one of the storage levels between: a storage position in which the first and second immersion tanks are spaced from each other by a first distance; and an access position in which the first and second immersion tanks are spaced from each other by a second distance greater than the first distance, wherein in the access position, the first and second immersion tanks are accessible by an operator for accessing the electronic devices contained therein.

Abstract: A hybrid cooling system that includes both immersion cooling and channelized cooling is described. The system cools an electronic device that includes a heat-generating component. The system includes a container that contains a dielectric immersion cooling liquid, the electronic device being, at least in part, immersed in the dielectric immersion cooling liquid, and a liquid cooling block through which a channelized cooling liquid is conveyed. The liquid cooling block is in thermal contact with the heat-generating component, and the channelized cooling liquid has a density that is higher than a density of the dielectric immersion cooling liquid. The system also includes a testing arrangement disposed in a bottom portion of the container, to determine the presence of the channelized cooling liquid in the bottom portion of the container, indicating a leak of the channelized cooling liquid into the dielectric immersion cooling liquid.

Abstract: An immersive cooling system is described. The system includes an immersive cooling container, including: a first reservoir; a second reservoir; numerous slots, each configured to hold a casing; a reservoir connector corresponding to each slot, and configured to provide fluid communication with the first reservoir; and a pump configured to convey a dielectric immersion cooling liquid from the second reservoir to the first reservoir. The immersive cooling system also includes a casing, configured to contain an electronic device and to fit within a slot of the container. The casing includes an inlet configured to be in fluid communication with the reservoir connector of the slot within which the casing is disposed to facilitate flow of the cooling liquid into an interior of the casing through the reservoir connector and an outlet configured to facilitate flow of the cooling liquid from the interior of the casing into the second reservoir.

Abstract: A method is provided for positioning a data center rack relative to a rack-supporting frame. The method includes connecting at least one front attachment member to the data center rack on a front side thereof such that part of one of the at least one front attachment member and part of one of the at least one front attachment member extend leftward from a left end and rightward from a right end respectively of the data center rack; lifting and inserting the data center rack between a left and a right vertical support units until the at least one front attachment member abuts the left and right vertical support units; and moving the data center rack leftward or rightward until a hook portion of the at least one front attachment member engages the left or right vertical support unit to set a lateral position of the data center rack.

Abstract: A cooling system comprises a container receiving a dielectric cooling liquid and electronic components immersed in the dielectric cooling liquid. A first pump causes a circulation of a first fraction of the dielectric cooling liquid in the container for convection cooling of the electronic components. A second pump withdraws a second fraction of the dielectric cooling liquid from the container and directs the second fraction of the dielectric cooling liquid toward the electronic components for direct cooling of the electronic components. A manifold fluidly connected to an outlet of the second pump receives the second fraction of the dielectric cooling liquid from the second pump. One or more outlet pipes fluidly connected to the manifold bring portions of the second fraction of the dielectric cooling liquid in thermal contact with the electronic components.

Abstract: A liquid cooling device for cooling at least one target component that includes: a base member to be in thermal contact with the at least one target component to be cooled by the liquid cooling device, the base member including a lower surface configured to be placed in contact with the at least one target component, the base member defining a plurality of pockets spaced apart from one another on an upper side thereof and defining a plurality of fluid conduits configured to internally circulate a cooling liquid therethrough. Each of the plurality of pockets arranged to accommodate a corresponding fluid conduit and an interconnecting channel defined by the base member and extending between two neighboring pockets of the plurality of pockets for distributing the cooling fluid from the fluid conduit of one pocket to the fluid conduit of a neighboring pocket.

Abstract: An uninterruptible power supply (UPS) includes: a housing defining an interior space; a door operatively connected to the housing, the door being configured to be selectively opened and closed for accessing the interior space of the housing; san electrical system enclosed within the housing; at least one liquid cooling device mounted to a target component of the UPS disposed within the housing for cooling thereof, the at least one liquid cooling device defining a fluid conduit for circulating fluid therethrough; and a pumping module including at least one pump fluidly connected to the at least one liquid cooling device for circulating fluid therethrough, each of the at least one pump and the fluid conduit of the at least one liquid cooling device defining in part a liquid cooling circuit, the pumping module being mounted to the door and disposed on an exterior side thereof.

Abstract: A cooling assembly for a data center rack includes: a chassis; a heat exchanger connected to the chassis, the heat exchanger being disposed vertically at least in part between upper and lower ends of the chassis, and at least one lower bracket connected to a lower end portion of the chassis. The heat exchanger includes: a cooling coil for circulating a cooling fluid therethrough; and a plurality of fins connected to the cooling coil, the fins being spaced from one another to allow air flow therebetween. Each of the at least one lower bracket is a single piece of sheet metal bent into shape and includes a supporting wall extending frontward from the lower end portion of the chassis, the supporting wall being configured to receive at least in part a lower end of the data center rack thereon.

Abstract: A rack system for a data center includes: a plurality of racks configured to house electronic equipment therein, at least one rack column being formed by at least some of the racks being disposed above one another, each rack having a rack depth measured in a front-to-rear direction; and at least one supporting pedestal disposed below the at least one rack column in order to support the at least one rack column, the at least one supporting pedestal being configured to be positioned on a ground surface of the data center to distribute a load of the at least one rack column on the ground surface, each of the at least one supporting pedestal having a pedestal depth measured in the front-to-rear direction, the pedestal depth being greater than the rack depth, a ratio of the pedestal depth over the rack depth being between 1.2 and 2.5 inclusively.

Abstract: A liquid cooling device for cooling at least one target component includes a base member configured to be in thermal contact with the at least one target component to be cooled by the liquid cooling device. The base member defines a plurality of pockets spaced apart from one another. A plurality of cover members are connected to the base member and are at least partially received in a corresponding pocket. Each cover member has a fluid inlet and outlet. The cover and base members define together a plurality of fluid conduits that are independent from one another. Each fluid conduit is defined between a cover member and the base member such that a number of the fluid conduits is equal to a number of the cover members. Each fluid conduit respectively receives and discharges fluid through the fluid inlet and the fluid outlet of the corresponding cover member.

Abstract: A cooling system (50) including an immersion case, a bladder and a controller is disclosed. The immersion case (54) is configured to house an immersion cooling liquid, and an electronic component (80) configured to be submerged in the immersion cooling liquid. The bladder (56) is configurable between an expanded state and a contracted state and positioned such that the bladder (56) can be at least partially submerged in the immersion cooling liquid when in any one of the expanded state and the contracted state. The controller (58) is connected to the bladder (56) for modulating the bladder (56) between the expanded state and the contracted state to modulate a fluid level of the immersion cooling liquid in the immersion case (54).

Abstract: A rack system for use, e.g., in data centers is disclosed. The rack system includes a rack frame and a rack-mounted assembly, including an electronic device disposed within the rack-mounted assembly, the electronic device including a heat-generating component. The heat-generating component is in thermal contact with a liquid cooling block through which a channelized cooling fluid is conveyed. The electronic device is immersed in a dielectric immersion cooling liquid. The rack-mounted assembly includes a non-sealed immersion case in which the electronic device is immersed in the dielectric immersion cooling liquid, the non-sealed immersion case configured to permit the rack-mounted assembly to be individually inserted into or removed from the rack frame. Also disclosed are container-based data center modules based on the disclosed rack system, and a data center using numerous such container-based modules.

Abstract: A method and an extraction system for extracting an electronic device from a container filled with an immersion cooling liquid are disclosed. The extraction system includes a lifting device for lifting the electronic device from an open end of the container, a liquid dispersing device for dispersing immersion cooling liquid from the electronic device by generating an air flow, and a nozzle configured to be positioned above the open end of the container to limit a spread of immersion cooling liquid caused by the liquid dispersing device.

Abstract: A cooling system comprises a main cooling arrangement thermally coupled to the heat generating component, and configured for collecting thermal energy of the heat generating component via a main heat transfer fluid, and a backup cooling arrangement thermally coupled to the main cooling arrangement and comprising at least one fluid path configured for conducting a backup heat transfer fluid. The cooling system comprises a thermal fuse disposed within at least a portion of the at least one fluid path, the thermal fuse changing from a solid state to a melted state and selectively enabling a flow of the backup heat transfer fluid in the at least one fluid path of the backup cooling arrangement in response to its temperature being above a temperature threshold, the backup heat transfer fluid being configured to, upon flowing in the at least one fluid path, collect thermal energy from the main cooling arrangement.

Abstract: A cooling system comprises a container receiving a dielectric cooling liquid and electronic components immersed in the dielectric cooling liquid. A first pump causes a circulation of a first fraction of the dielectric cooling liquid in the container for convection cooling of the electronic components. A second pump withdraws a second fraction of the dielectric cooling liquid from the container and directs the second fraction of the dielectric cooling liquid toward the electronic components for direct cooling of the electronic components. A manifold fluidly connected to an outlet of the second pump receives the second fraction of the dielectric cooling liquid from the second pump. One or more outlet pipes fluidly connected to the manifold bring portions of the second fraction of the dielectric cooling liquid in thermal contact with the electronic components.

Abstract: A rack system for housing an electronic device comprises an immersion case configured to provide housing to the electronic device. The immersion case includes a first wall, and a second wall. The first wall and the second wall define means for controlling deformation of the immersion case, such that when an immersion cooling liquid is inserted in the immersion case, the means for controlling deformation limit the deformation of the immersion case.