Patents by Inventor Gregory Frank Piatt

Gregory Frank Piatt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200328271
    Abstract: Implementations of capacitors may include: a first electrode having a first side and a second side. The capacitor may also include a silicon nitride (SiN) layer including on the second side of the first electrode. An opening may be included in the silicon nitride layer. The capacitors may include a dielectric layer within the opening of the SiN layer. The dielectric layer may include a recess. The capacitor may also include a second electrode having a first side and a second side. The first side of the second electrode may be included within the recess of the dielectric layer.
    Type: Application
    Filed: July 9, 2019
    Publication date: October 15, 2020
    Inventors: Jeffrey Peter GAMBINO, David T. PRICE, Akihiro HASEGAWA, Derryl ALLMAN, Sallie J. HOSE, Kenneth Andrew BATES, Gregory Frank PIATT
  • Patent number: 7204920
    Abstract: A contact ring for use in electroplating of a substrate material is constructed such that fluid (e.g., electrolyte) is allowed to flow radially away from the axis of a toroidal support ring, thus preventing the trapping of fluids between the substrate and the toroidal support ring. The contact ring is constructed with a series of openings arranged about the circumference of the ring and wherein an electrical contact is placed in the path of each opening so any fluid passing through the opening also passes around the associated electrical contact. Further, the electrical contacts are also placed such that a substrate (e.g., a semiconductor wafer) can be placed inside the support ring so as to electrically contact the electrical contacts. The toroidal support ring has an aerodynamically streamlined cross-section at the openings, such that fluid flows through the openings with reduced aerodynamic drag.
    Type: Grant
    Filed: October 25, 2004
    Date of Patent: April 17, 2007
    Assignee: LSI Logic Corporation
    Inventors: Byung-Sung Leo Kwak, Gregory Frank Piatt, Hiroshi Mizuno