Abstract: An article may include a structure including a patterned metal on a surface of a substrate, the patterned metal including metal features separated by gaps of an average dimension of less than about 1000 nm. A porous low dielectric constant material having a dielectric value of less than about 2.7 substantially occupies all gaps. An interface between the metal features and the porous low dielectric constant material may include less than about 0.1% by volume of voids.

Abstract: An article may include a structure including a patterned metal on a surface of a substrate, the patterned metal including metal features separated by gaps of an average dimension of less than about 1000 nm. A porous low dielectric constant material having a dielectric value of less than about 2.7 substantially occupies all gaps. An interface between the metal features and the porous low dielectric constant material may include less than about 0.1% by volume of voids.

Abstract: An article may include a structure including a patterned metal on a surface of a substrate, the patterned metal including metal features separated by gaps of an average dimension of less than about 1000 nm. A porous low dielectric constant material having a dielectric value of less than about 2.7 substantially occupies all gaps. An interface between the metal features and the porous low dielectric constant material may include less than about 0.1% by volume of voids. A method may include depositing a filling material including a silicon-based resin having a molecular weight of less than about 30,000 Da and a porogen having a molecular weight greater than about 400 Da onto a structure comprising a patterned metal. The deposited filling material may be subjected to a first thermal treatment to substantially fill all gaps, and subjected to a second thermal treatment and a UV radiation treatment.

Abstract: An article may include a structure including a patterned metal on a surface of a substrate, the patterned metal including metal features separated by gaps of an average dimension of less than about 1000 nm. A porous low dielectric constant material having a dielectric value of less than about 2.7 substantially occupies all gaps. An interface between the metal features and the porous low dielectric constant material may include less than about 0.1% by volume of voids. A method may include depositing a filling material including a silicon-based resin having a molecular weight of less than about 30,000 Da and a porogen having a molecular weight greater than about 400 Da onto a structure comprising a patterned metal. The deposited filling material may be subjected to a first thermal treatment to substantially fill all gaps, and subjected to a second thermal treatment and a UV radiation treatment.

Abstract: A wall system for improved water drainage, and diminished probability of occurrence of mold, mildew and rot formation behind cladding attached to the wall system. The wall system is generally material agnostic, and may be used as an interface between a structural-wall sheathing (including house wraps, gage-metal framing, and felt), and exterior-façade materials, including, but not necessarily limited to: faux masonry, faux stone, mortar, stucco, and other aesthetic or exterior-façade materials. The following disclosure is also directed to systems and methods of attaching faux stone to a wall.

Abstract: A wall system for improved water drainage, and diminished probability of occurrence of mold, mildew and rot formation behind cladding attached to the wall system. The wall system is generally material agnostic, and may be used as an interface between a structural-wall sheathing (including house wraps, gage-metal framing, and felt), and exterior-façade materials, including, but not necessarily limited to: faux masonry, faux stone, mortar, stucco, and other aesthetic or exterior-façade materials. The following disclosure is also directed to systems and methods of attaching faux stone to a wall.

Abstract: A solid-surface article may include a surface layer including at least one of gel coat, epoxy, glass, silicone, diamonds, and mica. The article may also include a sub-layer including a resin, curing agent, a color pigment, and resin filler/fillers. The composite article may resemble a countertop, such as granite, marble, polished concrete, quartz, glass, laminate, wood, stone, and copper countertops.

Abstract: A wall system for improved water drainage, and diminished probability of occurrence of mold, mildew and rot formation behind cladding attached to the wall system. The wall system is generally material agnostic, and may be used as an interface between a structural-wall sheathing (including house wraps, gage-metal framing, and felt), and exterior-façade materials, including, but not necessarily limited to: faux masonry, faux stone, mortar, stucco, and other aesthetic or exterior-façade materials. The following disclosure is also directed to systems and methods of attaching faux stone to a wall.

Abstract: An expandable fire pit assembly including a first and second planar member. The first planar member and the second planar member include an upper edge, a lower edge, a first end having a tab member, and a second end having a slot. The tab member of the first planar member engages the slot of the second planar member and the tab member of the second planar member engages the slot of the first planar member, thereby interlocking the first planar member and the second planar member together forming a ring. The fire pit assembly can also include a gas burner connected to one of the planar members and is attachable to a gas supply source.

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation structures and may accommodate a high density of the circuitry cards. Embodiments may include one surface with one or more ridges for rigidity and ventilation and fin slots for receiving circuit card guide fins. Embodiments may include a surface with knockouts for receiving circuit card guides. Embodiments may also include multiple bracket hole patterns for mounting brackets for different racks or for a single multi-rack bracket having more than one mounting hole pattern. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation structures of the chassis and includes some components chosen for low-power consumption or reduced flammability.