Patents by Inventor Gregory G. Beninati
Gregory G. Beninati has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11926006Abstract: A method of manufacture is provided that includes providing a preform component. The preform component includes a blind aperture in an exterior of the preform component. The exterior of the preform component is machined to provide a machined component. An exterior of the machined component is inspected to determine a characteristic of the machined component, which characteristic of the machined component is associated with the blind aperture. Whether a feature of the machined component satisfies a standard is determined based on the characteristic of the machined component.Type: GrantFiled: March 17, 2021Date of Patent: March 12, 2024Assignee: RAYTHEON COMPANYInventors: Travis Mayberry, Gregory G. Beninati, Matthew Kelly, Michael Arthur
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Publication number: 20230209728Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.Type: ApplicationFiled: February 23, 2023Publication date: June 29, 2023Inventors: Mikhail Pevzner, Gregory G. Beninati, James E. Benedict, Andrew R. Southworth
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Patent number: 11606865Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.Type: GrantFiled: November 8, 2019Date of Patent: March 14, 2023Assignee: RAYTHEON COMPANYInventors: Mikhail Pevzner, Gregory G. Beninati, James E. Benedict, Andrew R. Southworth
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Publication number: 20220297248Abstract: A method of manufacture is provided that includes providing a preform component. The preform component includes a blind aperture in an exterior of the preform component. The exterior of the preform component is machined to provide a machined component. An exterior of the machined component is inspected to determine a characteristic of the machined component, which characteristic of the machined component is associated with the blind aperture. Whether a feature of the machined component satisfies a standard is determined based on the characteristic of the machined component.Type: ApplicationFiled: March 17, 2021Publication date: September 22, 2022Inventors: Travis Mayberry, Gregory G. Beninati, Matthew Kelly, Michael Arthur
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Patent number: 11317502Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.Type: GrantFiled: May 15, 2020Date of Patent: April 26, 2022Assignee: Raytheon CompanyInventors: Thomas V. Sikina, John P. Haven, James E. Benedict, William J. Clark, Channing P. Favreau, Erika Klek, Mikhail Pevzner, Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen
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Publication number: 20210400820Abstract: A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.Type: ApplicationFiled: September 2, 2021Publication date: December 23, 2021Inventors: James E. Benedict, Gregory G. Beninati, Mikhail Pevzner, Thomas V. Sikina, Andrew R. Southworth
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Publication number: 20210360772Abstract: Methods and apparatus for providing a cavity defined by conductive walls, a printed circuit board (PCB) within the cavity, and shorting posts extending into the cavity to suppress higher order modes generated by operation of the PCB.Type: ApplicationFiled: May 15, 2020Publication date: November 18, 2021Applicant: Raytheon CompanyInventors: Thomas V. Sikina, John P. Haven, James E. Benedict, William J. Clark, Channing P. Favreau, Erika Klek, Mikhail Pevzner, Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen
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Patent number: 11122692Abstract: A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.Type: GrantFiled: June 11, 2020Date of Patent: September 14, 2021Assignee: RAYTHEON COMPANYInventors: James E. Benedict, Gregory G. Beninati, Mikhail Pevzner, Thomas V. Sikina, Andrew R. Southworth
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Publication number: 20210144864Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.Type: ApplicationFiled: November 8, 2019Publication date: May 13, 2021Inventors: Mikhail Pevzner, Gregory G. Beninati, James E. Benedict, Andrew R. Southworth
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Patent number: 10999938Abstract: Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.Type: GrantFiled: April 29, 2020Date of Patent: May 4, 2021Assignee: Raytheon CompanyInventors: Mikhail Pevzner, Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen, James E. Benedict
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Patent number: 10775109Abstract: An improved heat exchanger assembly and method. First and second plates made of a predetermined thermally conductive material are configured when mated to form a hermetically sealed vapor chamber. A wick made of the same predetermined thermally conductive material resides in the vapor chamber forming a gas chamber.Type: GrantFiled: June 21, 2018Date of Patent: September 15, 2020Assignee: Raytheon CompanyInventors: N. D. Nelson, Vincent J. Milano, Gregory G. Beninati, Cameron B. Goddard, Matthew D. Thoren, Edward I. Holmes
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Publication number: 20180306522Abstract: An improved heat exchanger assembly and method. First and second plates made of a predetermined thermally conductive material are configured when mated to form a hermetically sealed vapor chamber. A wick made of the same predetermined thermally conductive material resides in the vapor chamber forming a gas chamber.Type: ApplicationFiled: June 21, 2018Publication date: October 25, 2018Inventors: N.D. Nelson, Vincent J. Milano, Gregory G. Beninati, Cameron B. Goddard, Matthew D. Thoren, Edward I. Holmes
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Patent number: 10026674Abstract: A method for forming a cooling structure having a plurality of cooling members. The method includes: providing a template having a plurality of features, such members projecting outward from a base of a template or holes passing into the template, the features being arranged in a predetermined pattern, such pattern being selected in accordance with the predetermined pattern of cooling members; and forming a conformal coating of diamond over the features.Type: GrantFiled: December 22, 2015Date of Patent: July 17, 2018Assignee: Raytheon CompanyInventors: Joseph M. Wahl, Travis L. Mayberry, Gregory G. Beninati
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Publication number: 20170178996Abstract: A method for forming a cooling structure having a plurality of cooling members. The method includes: providing a template having a plurality of features, such members projecting outward from a base of a template or holes passing into the template, the features being arranged in a predetermined pattern, such pattern being selected in accordance with the predetermined pattern of cooling members; and forming a conformal coating of diamond over the features.Type: ApplicationFiled: December 22, 2015Publication date: June 22, 2017Applicant: Raytheon CompanyInventors: Joseph M. Wahl, Travis L. Mayberry, Gregory G. Beninati
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Publication number: 20100163211Abstract: An improved heat exchanger assembly and method. First and second plates made of a predetermined thermally conductive material are configured when mated to form a hermetically sealed vapor chamber. A wick made of the same predetermined thermally conductive material resides in the vapor chamber forming a gas chamber.Type: ApplicationFiled: December 30, 2008Publication date: July 1, 2010Inventors: N. D. Nelson, Vincent J. Milano, Gregory G. Beninati, Cameron B. Goddard, Matthew D. Thoren, Edward I. Holmes