Abstract: Methods and systems for detecting changes in currents are disclosed, including: dividing a main current into two or more subcurrents, combining a first magnetic flux of a first subcurrent of the two or more of the subcurrents with another magnetic flux of another current to generate a combined magnetic flux, and sensing the combined magnetic flux to determine relative changes between the first subcurrent and the other current.

Abstract: Methods and systems for detecting changes in currents are disclosed, including: dividing a main current into two or more subcurrents, combining a first magnetic flux of a first subcurrent of the two or more of the subcurrents with another magnetic flux of another current to generate a combined magnetic flux, and sensing the combined magnetic flux to determine relative changes between the first subcurrent and the other current.

Abstract: Disclosed is a mounting structure for mounting an IC on a substrate, and particularly useful in a Multi-Chip Module (MCM). The mounting structure intervenes between the IC and the MCM substrate, and promotes heat dissipation from the IC. The mounting structure is insulative, and preferably comprises a direct bond to copper (DBC) board. A heat spreading region to which the IC is affixed is formed on a surface of the mounting structure with bond pad areas are around the heat spreading region. The other side of the mounting structure is mounted to the substrate, which also has bond pads. Bond pads on the IC are connected to the bond pad areas on the mounting structure, and the bond pad areas on the mounting structure are further coupled to the bond pads on the substrate. Each of these connections is preferably made by wirebonding. Thermal vias can be used in the mounting structure and/or in the substrate to further promote heat dissipation.